John H. Lau
About
John H. Lau is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials.
According to data from OpenAlex, John H. Lau has authored 242 papers receiving a total of 3.4k indexed citations (citations by other indexed papers that have themselves been cited), including 206 papers in Electrical and Electronic Engineering, 61 papers in Mechanical Engineering and 47 papers in Mechanics of Materials. Recurrent topics in John H. Lau’s work include Electronic Packaging and Soldering Technologies (171 papers), 3D IC and TSV technologies (153 papers) and Electromagnetic Compatibility and Noise Suppression (24 papers). John H. Lau is often cited by papers focused on Electronic Packaging and Soldering Technologies (171 papers), 3D IC and TSV technologies (153 papers) and Electromagnetic Compatibility and Noise Suppression (24 papers). John H. Lau collaborates with scholars based in United States, Taiwan and Singapore. John H. Lau's co-authors include S. W. Ricky Lee, S. Erasmus, Xiaowu Zhang, Walter Dauksher and V. Kripesh and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of Bone and Joint Surgery.
In The Last Decade
Fields of papers citing papers by John H. Lau
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
This network shows the specialization of papers citing the papers produced by John H. Lau. Nodes represent fields, and links connect fields that are likely to share authors. The network helps show where John H. Lau may publish in the future.
Countries citing papers authored by John H. Lau
Since SpecializationCitations
This map shows the geographic impact of John H. Lau's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by John H. Lau with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites John H. Lau more than expected).
Explore authors with similar magnitude of impact
Breakdown of academic impact, for papers by Christian Waldschmidt Breakdown of academic impact, for papers by Nobuhisa Akamatsu Breakdown of academic impact, for papers by Eunju Park Breakdown of academic impact, for papers by Shiping Chen Breakdown of academic impact, for papers by Qingfeng Zhang Breakdown of academic impact, for papers by P. A. Alvi Breakdown of academic impact, for papers by Rosangela Zacarias Machado Breakdown of academic impact, for papers by Yonggang Liu