J. Swingler
Impact in
- Mechanical Engineering top 5%
- Electrical Contact Performance and Analysis
- Innovative Energy Harvesting Technologies
- Mechanics of Materials top 5%
- Adhesion, Friction, and Surface Interactions
- Mechanical stress and fatigue analysis
Papers in
-
- Electrical Contact Performance and Analysis 40
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- Adhesion, Friction, and Surface Interactions 19
- Mechanical stress and fatigue analysis 16
- Co-authors
- J.W. McBride (31 shared papers)C. Maul (5 shared papers)Paul M. Weaver (8 shared papers)I.P. Lipscomb (3 shared papers)Deyi Zheng (4 shared papers)J C Inkson (3 shared papers)David Flynn (4 shared papers)M. Moshrefi‐Torbati (1 shared paper)
- Journals
- IEEE Transactions on Components and Packaging Technologies (7 papers)Sensors and Actuators A Physical (4 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)IEEE Access (2 papers)Wear (2 papers)
- Partner nations
- United KingdomChinaMalaysia
In The Last Decade
J. Swingler
76 papers receiving 929 citations
Peers
Comparison fields: 5 of 62
- Mechanical Engineering 645
- Mechanics of Materials 323
- Electrical and Electronic Engineering 362
- Biomedical Engineering 235
- Atomic and Molecular Physics, and Optics 154
Countries citing papers authored by J. Swingler
This map shows the geographic impact of J. Swingler's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Swingler with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Swingler more than expected).
Fields of papers citing papers by J. Swingler
This network shows the impact of papers produced by J. Swingler. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Swingler. The network helps show where J. Swingler may publish in the future.
Co-authors
The 24 scholars most cited alongside J. Swingler, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 76 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2015 | 127 | |
| 2 | 2000 | 80 | |
| 3 | 2001 | 55 | |
| 4 | 2010 | 48 | |
| 5 | 2009 | 48 | |
| 6 | 1996 | 46 | |
| 7 | 2017 | 45 | |
| 8 | 2002 | 28 | |
| 9 | 2000 | 24 | |
| 10 | 2017 | 21 | |
| 11 | 2011 | 20 | |
| 12 | 2009 | 20 | |
| 13 | 1998 | 20 | |
| 14 | Correlation between wear and electrical behaviour of contact interfaces during fretting vibration | 2005 | 19 |
| 15 | 2012 | 19 | |
| 16 | The synergistic relationship of stresses in the automotive connector | 1998 | 17 |
| 17 | 2015 | 17 | |
| 18 | 2010 | 14 | |
| 19 | 2018 | 12 | |
| 20 | 2009 | 12 |
About J. Swingler
J. Swingler is a scholar working on Mechanical Engineering, Mechanics of Materials, Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Biomedical Engineering, having authored 76 papers that have together received 976 indexed citations. Recurring topics across this work include Electrical Contact Performance and Analysis (40 papers), Adhesion, Friction, and Surface Interactions (19 papers), Mechanical stress and fatigue analysis (16 papers), Electrical Fault Detection and Protection (12 papers), Vacuum and Plasma Arcs (11 papers), Advanced Sensor and Energy Harvesting Materials (11 papers), Electronic Packaging and Soldering Technologies (7 papers) and Force Microscopy Techniques and Applications (6 papers). The work is most often cited by research in Mechanical Engineering (645 citations), Mechanics of Materials (323 citations), Electrical and Electronic Engineering (362 citations), Biomedical Engineering (235 citations) and Atomic and Molecular Physics, and Optics (154 citations). J. Swingler has collaborated with scholars based in United Kingdom, China and Malaysia. Frequent co-authors include J.W. McBride, C. Maul, Paul M. Weaver, I.P. Lipscomb, Deyi Zheng, J C Inkson, David Flynn, M. Moshrefi‐Torbati, Min Luo and Changhai Wang. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies, Sensors and Actuators A Physical, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Access and Wear.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.