Hui Deng
Impact in
- Biomedical Engineering top 2%
- Advanced Surface Polishing Techniques
- Ceramics and Composites top 5%
Papers in
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- Advanced Surface Polishing Techniques 81
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- Diamond and Carbon-based Materials Research 50
- Co-authors
- Kazuya Yamamura (37 shared papers)Katsuyoshi Endo (14 shared papers)Chen‐Nee Chuah (1 shared paper)Dipak Ghosal (1 shared paper)Michael Zhang (1 shared paper)Xinquan Zhang (12 shared papers)Linfeng Zhang (8 shared papers)Masaki Ueda (5 shared papers)
In The Last Decade
Hui Deng
134 papers receiving 2.6k citations
Peers
Comparison fields: 5 of 105
- Biomedical Engineering 1.5k
- Ceramics and Composites 189
- Materials Chemistry 1.1k
- Electrical and Electronic Engineering 1.1k
- Mechanics of Materials 390
Countries citing papers authored by Hui Deng
This map shows the geographic impact of Hui Deng's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hui Deng with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hui Deng more than expected).
Fields of papers citing papers by Hui Deng
This network shows the impact of papers produced by Hui Deng. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hui Deng. The network helps show where Hui Deng may publish in the future.
Co-authors
The 25 scholars most cited alongside Hui Deng, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 145 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2015 | 302 | |
| 2 | 2011 | 158 | |
| 3 | 2015 | 126 | |
| 4 | 2021 | 93 | |
| 5 | 2016 | 75 | |
| 6 | 2013 | 74 | |
| 7 | 2015 | 55 | |
| 8 | 2021 | 54 | |
| 9 | 2020 | 54 | |
| 10 | 2015 | 53 | |
| 11 | 2014 | 50 | |
| 12 | 2005 | 49 | |
| 13 | 2020 | 48 | |
| 14 | 2012 | 43 | |
| 15 | 2019 | 40 | |
| 16 | 2020 | 38 | |
| 17 | 2017 | 38 | |
| 18 | 2021 | 34 | |
| 19 | 2019 | 34 | |
| 20 | 2020 | 32 |
About Hui Deng
Hui Deng is a scholar working on Biomedical Engineering, Materials Chemistry, Electrical and Electronic Engineering, Mechanics of Materials and Computational Mechanics, having authored 145 papers that have together received 2.6k indexed citations. Recurring topics across this work include Advanced Surface Polishing Techniques (81 papers), Diamond and Carbon-based Materials Research (50 papers), Metal and Thin Film Mechanics (24 papers), Semiconductor materials and devices (20 papers), Advanced Machining and Optimization Techniques (19 papers), Integrated Circuits and Semiconductor Failure Analysis (16 papers), Advanced machining processes and optimization (11 papers) and Silicon Carbide Semiconductor Technologies (9 papers). The work is most often cited by research in Biomedical Engineering (1.5k citations), Ceramics and Composites (189 citations), Materials Chemistry (1.1k citations), Electrical and Electronic Engineering (1.1k citations) and Mechanics of Materials (390 citations). Hui Deng has collaborated with scholars based in China, Japan and Singapore. Frequent co-authors include Kazuya Yamamura, Katsuyoshi Endo, Chen‐Nee Chuah, Dipak Ghosal, Michael Zhang, Xinquan Zhang, Linfeng Zhang, Masaki Ueda, Peng Liu and Yi Zhang. Their work appears in journals such as Journal of Manufacturing Processes, Journal of Materials Processing Technology, CIRP Annals, Applied Surface Science and International Journal of Machine Tools and Manufacture.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.