How Tseng
Impact in
- Biomaterials top 2%
- biodegradable polymer synthesis and properties
- Electrospun Nanofibers in Biomedical Applications
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- Carbon dioxide utilization in catalysis
Papers in
-
- Electronic Packaging and Soldering Technologies 16
- 3D IC and TSV technologies 12
- Surgery 9
- Tissue Engineering and Regenerative Medicine 5
- Co-authors
- Haw‐Ming Huang (3 shared papers)Sheng‐Yang Lee (3 shared papers)Chien‐Chung Chen (1 shared paper)Ju-Yu Chueh (1 shared paper)Shih‐Han Hung (14 shared papers)Cheng‐Yi Liu (11 shared papers)Yuan‐Soon Ho (4 shared papers)Shyr‐Yi Lin (4 shared papers)
In The Last Decade
How Tseng
55 papers receiving 1.3k citations
Peers
Comparison fields: 5 of 121
- Biomaterials 519
- Process Chemistry and Technology 72
- Polymers and Plastics 142
- Orthodontics 31
- Automotive Engineering 92
Countries citing papers authored by How Tseng
This map shows the geographic impact of How Tseng's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by How Tseng with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites How Tseng more than expected).
Fields of papers citing papers by How Tseng
This network shows the impact of papers produced by How Tseng. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by How Tseng. The network helps show where How Tseng may publish in the future.
Co-authors
The 25 scholars most cited alongside How Tseng, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 56 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2003 | 471 | |
| 2 | 2008 | 124 | |
| 3 | 2003 | 67 | |
| 4 | 2013 | 47 | |
| 5 | 2013 | 46 | |
| 6 | 2016 | 45 | |
| 7 | 2005 | 37 | |
| 8 | 1995 | 33 | |
| 9 | 2006 | 31 | |
| 10 | 2010 | 31 | |
| 11 | 2002 | 22 | |
| 12 | 2001 | 21 | |
| 13 | 2012 | 20 | |
| 14 | 1994 | 19 | |
| 15 | 2010 | 18 | |
| 16 | 2010 | 16 | |
| 17 | 2021 | 14 | |
| 18 | 2008 | 14 | |
| 19 | 2011 | 13 | |
| 20 | 2008 | 13 |
About How Tseng
How Tseng is a scholar working on Electrical and Electronic Engineering, Surgery, Mechanical Engineering, Electronic, Optical and Magnetic Materials and Molecular Biology, having authored 56 papers that have together received 1.3k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (12 papers), Copper Interconnects and Reliability (8 papers), Electrospun Nanofibers in Biomedical Applications (5 papers), Tissue Engineering and Regenerative Medicine (5 papers), Tracheal and airway disorders (4 papers), Bone Tissue Engineering Materials (4 papers) and Advanced Welding Techniques Analysis (3 papers). The work is most often cited by research in Biomaterials (519 citations), Process Chemistry and Technology (72 citations), Polymers and Plastics (142 citations), Orthodontics (31 citations) and Automotive Engineering (92 citations). How Tseng has collaborated with scholars based in Taiwan, India and Japan. Frequent co-authors include Haw‐Ming Huang, Sheng‐Yang Lee, Chien‐Chung Chen, Ju-Yu Chueh, Shih‐Han Hung, Cheng‐Yi Liu, Yuan‐Soon Ho, Shyr‐Yi Lin, Chih‐Hsiung Wu and Ying‐Jan Wang. Their work appears in journals such as Journal of Electronic Materials, Journal of Oral Rehabilitation, International Journal of Molecular Sciences, European Archives of Oto-Rhino-Laryngology and Electrochemical and Solid-State Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.