Hongtao Chen

176 papers and 2.8k indexed citations i.

Hongtao Chen has authored 176 papers that have received a total of 2.8k indexed citations. This includes 103 papers in Electrical and Electronic Engineering, 59 papers in Mechanical Engineering and 40 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (51 papers), 3D IC and TSV technologies (32 papers) and Aluminum Alloys Composites Properties (27 papers). Hongtao Chen is often cited by papers focused on Electronic Packaging and Soldering Technologies (51 papers), 3D IC and TSV technologies (32 papers) and Aluminum Alloys Composites Properties (27 papers) and collaborates with scholars based in China, United States and Finland. Hongtao Chen's co-authors include Mingyu Li, Yangyang Lu, Ruiqiang Ji and Weiwei Zhu and has published in prestigious journals such as Proceedings of the National Academy of Sciences, Applied Physics Letters and Langmuir.