Hongqiang Zhang
About
Hongqiang Zhang has authored 80 papers that have received a total of 1.3k indexed citations.
This includes 53 papers in Mechanical Engineering, 29 papers in Electrical and Electronic Engineering and 28 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (20 papers), Aluminum Alloys Composites Properties (19 papers) and Surface Treatment and Residual Stress (17 papers). Hongqiang Zhang is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), Aluminum Alloys Composites Properties (19 papers) and Surface Treatment and Residual Stress (17 papers) and collaborates with scholars based in China, Canada and Taiwan. Hongqiang Zhang's co-authors include Wei Guo, Peng Peng, Qiang Jia, Guisheng Zou and Zhandong Wan and has published in prestigious journals such as Proceedings of the National Academy of Sciences, ACS Applied Materials & Interfaces and Electrochimica Acta.
In The Last Decade
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