Hao Cui
Impact in
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- Welding Techniques and Residual Stresses
- Advanced Welding Techniques Analysis
- Non-Destructive Testing Techniques
Papers in
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- Electronic Packaging and Soldering Technologies 10
- 3D IC and TSV technologies 8
- Integrated Circuits and Semiconductor Failure Analysis 2
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- Welding Techniques and Residual Stresses 4
- Advanced Welding Techniques Analysis 3
- Non-Destructive Testing Techniques 2
- Co-authors
- Fenggui Lu (5 shared papers)Wenchao Tian (9 shared papers)Xinhua Tang (2 shared papers)Wenchao Tian (3 shared papers)Jing Shi (2 shared papers)Wenbo Yu (1 shared paper)Qiang Gao (1 shared paper)Zhiqiang Chen (2 shared papers)
- Journals
- Science and Technology of Welding & Joining (3 papers)Smart Materials and Structures (2 papers)The International Journal of Advanced Manufacturing Technology (1 paper)Journal of Science Advanced Materials and Devices (1 paper)Chemical Engineering and Processing - Process Intensification (1 paper)
- Partner nations
- ChinaUnited StatesBelgium
In The Last Decade
Hao Cui
23 papers receiving 298 citations
Peers
Comparison fields: 5 of 50
- Metals and Alloys 13
- Mechanical Engineering 128
- Electrical and Electronic Engineering 176
- Aerospace Engineering 45
- Mechanics of Materials 35
Countries citing papers authored by Hao Cui
This map shows the geographic impact of Hao Cui's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hao Cui with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hao Cui more than expected).
Fields of papers citing papers by Hao Cui
This network shows the impact of papers produced by Hao Cui. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hao Cui. The network helps show where Hao Cui may publish in the future.
Co-authors
The 25 scholars most cited alongside Hao Cui, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 28 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2005 | 94 | |
| 2 | 2014 | 44 | |
| 3 | 2022 | 19 | |
| 4 | 2019 | 17 | |
| 5 | 2013 | 15 | |
| 6 | 2023 | 14 | |
| 7 | 2020 | 12 | |
| 8 | 2023 | 10 | |
| 9 | 2014 | 10 | |
| 10 | 2018 | 10 | |
| 11 | 2014 | 10 | |
| 12 | 2014 | 7 | |
| 13 | 2020 | 7 | |
| 14 | 2014 | 7 | |
| 15 | 2022 | 7 | |
| 16 | 2016 | 5 | |
| 17 | 2020 | 4 | |
| 18 | 2021 | 4 | |
| 19 | 2024 | 4 | |
| 20 | 2020 | 3 |
About Hao Cui
Hao Cui is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Aerospace Engineering and Biomedical Engineering, having authored 28 papers that have together received 309 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (8 papers), Welding Techniques and Residual Stresses (4 papers), Aluminum Alloy Microstructure Properties (3 papers), Advanced Welding Techniques Analysis (3 papers), Advanced Sensor and Energy Harvesting Materials (2 papers), Integrated Circuits and Semiconductor Failure Analysis (2 papers) and Non-Destructive Testing Techniques (2 papers). The work is most often cited by research in Metals and Alloys (13 citations), Mechanical Engineering (128 citations), Electrical and Electronic Engineering (176 citations), Aerospace Engineering (45 citations) and Mechanics of Materials (35 citations). Hao Cui has collaborated with scholars based in China, United States and Belgium. Frequent co-authors include Fenggui Lu, Wenchao Tian, Xinhua Tang, Wenchao Tian, Xinhua Tang, Jing Shi, Wenbo Yu, Qiang Gao, Zhiqiang Chen and Yiming Zhang. Their work appears in journals such as Science and Technology of Welding & Joining, Smart Materials and Structures, The International Journal of Advanced Manufacturing Technology, Journal of Science Advanced Materials and Devices and Chemical Engineering and Processing - Process Intensification.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.