Hai Ding
Impact in
Papers in
-
- Electronic Packaging and Soldering Technologies 9
- 3D IC and TSV technologies 5
-
- Advanced Surface Polishing Techniques 4
- Co-authors
- I. Charles Ume (9 shared papers)Yujiao Shi (2 shared papers)He‐Zuo Lü (2 shared papers)Jing Chen (2 shared papers)Shu‐Qin Ding (2 shared papers)Wenbo Zhu (1 shared paper)Jianguo Hu (2 shared papers)Xiaoxiao Gao (1 shared paper)
- Journals
- Journal of Orthopaedic Surgery and Research (3 papers)IEEE Transactions on Components and Packaging Technologies (2 papers)Journal of Neuroinflammation (1 paper)Economic Modelling (1 paper)Journal of Materials Research and Technology (1 paper)
- Partner nations
- ChinaUnited States
In The Last Decade
Hai Ding
24 papers receiving 390 citations
Peers
Comparison fields: 5 of 93
- Neurology 21
- Industrial and Manufacturing Engineering 24
- Electrical and Electronic Engineering 116
- Economics and Econometrics 50
- Pathology and Forensic Medicine 29
Countries citing papers authored by Hai Ding
This map shows the geographic impact of Hai Ding's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hai Ding with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hai Ding more than expected).
Fields of papers citing papers by Hai Ding
This network shows the impact of papers produced by Hai Ding. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hai Ding. The network helps show where Hai Ding may publish in the future.
Co-authors
The 25 scholars most cited alongside Hai Ding, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 28 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2002 | 77 | |
| 2 | 2010 | 38 | |
| 3 | 2023 | 37 | |
| 4 | 2021 | 32 | |
| 5 | 2020 | 31 | |
| 6 | 2022 | 31 | |
| 7 | 2017 | 26 | |
| 8 | 2024 | 19 | |
| 9 | 2019 | 16 | |
| 10 | A projection moiré system for measuring warpage with case studies | 2002 | 14 |
| 11 | 2019 | 14 | |
| 12 | 2005 | 13 | |
| 13 | 2003 | 10 | |
| 14 | 2020 | 8 | |
| 15 | 2004 | 6 | |
| 16 | 2004 | 5 | |
| 17 | 2024 | 4 | |
| 18 | 2001 | 4 | |
| 19 | 2004 | 3 | |
| 20 | 2004 | 3 |
About Hai Ding
Hai Ding is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Surgery, Pathology and Forensic Medicine and Mechanical Engineering, having authored 28 papers that have together received 397 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (5 papers), Advanced Surface Polishing Techniques (4 papers), Energy, Environment, Economic Growth (3 papers), Spinal Cord Injury Research (3 papers), Orthopaedic implants and arthroplasty (3 papers), Metal Forming Simulation Techniques (2 papers) and Manufacturing Process and Optimization (2 papers). The work is most often cited by research in Neurology (21 citations), Industrial and Manufacturing Engineering (24 citations), Electrical and Electronic Engineering (116 citations), Economics and Econometrics (50 citations) and Pathology and Forensic Medicine (29 citations). Hai Ding has collaborated with scholars based in China and United States. Frequent co-authors include I. Charles Ume, Yujiao Shi, He‐Zuo Lü, Jing Chen, Shu‐Qin Ding, Wenbo Zhu, Jianguo Hu, Xiaoxiao Gao, Yameng Li and Zheng Fu. Their work appears in journals such as Journal of Orthopaedic Surgery and Research, IEEE Transactions on Components and Packaging Technologies, Journal of Neuroinflammation, Economic Modelling and Journal of Materials Research and Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.