Guangchen Xu

20 papers and 343 indexed citations i.

About

Guangchen Xu has authored 20 papers that have received a total of 343 indexed citations. This includes 20 papers in Electrical and Electronic Engineering, 13 papers in Electronic, Optical and Magnetic Materials and 7 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (16 papers) and Copper Interconnects and Reliability (13 papers). Guangchen Xu is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (16 papers) and Copper Interconnects and Reliability (13 papers) and collaborates with scholars based in China, United States and Yemen. Guangchen Xu's co-authors include Fu Guo, Fu Guo, Xitao Wang, Yao Shi and Yongping Lei and has published in prestigious journals such as Journal of Materials Science, Journal of Alloys and Compounds and Journal of Material Science and Technology.

In The Last Decade

Fields of papers published by Guangchen Xu

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

Countries citing papers authored by Guangchen Xu

Since Specialization
Citations
Rankless by CCL
2025