Fu Guo
About
Fu Guo has authored 111 papers that have received a total of 1.6k indexed citations.
This includes 88 papers in Electrical and Electronic Engineering, 65 papers in Mechanical Engineering and 12 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (85 papers), 3D IC and TSV technologies (49 papers) and Advanced Welding Techniques Analysis (31 papers). Fu Guo is often cited by papers focused on Electronic Packaging and Soldering Technologies (85 papers), 3D IC and TSV technologies (49 papers) and Advanced Welding Techniques Analysis (31 papers) and collaborates with scholars based in China, United States and South Korea. Fu Guo's co-authors include Yongping Lei, Yao Shi, Zhidong Xia, Limin Ma and Guangchen Xu and has published in prestigious journals such as Journal of Applied Physics, Applied Energy and Carbohydrate Polymers.
In The Last Decade
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