Eric C. Cutiongco
Impact in
- Mechanics of Materials top 5%
- Metal and Thin Film Mechanics
- Tribology and Wear Analysis
- Adhesion, Friction, and Surface Interactions
- Mechanical Engineering top 10%
- Lubricants and Their Additives
Papers in
-
- Metal and Thin Film Mechanics 5
- Adhesion, Friction, and Surface Interactions 3
- Fatigue and fracture mechanics 1
-
- Lubricants and Their Additives 2
- Co-authors
- Yip-Wah Chung (3 shared papers)Charanjit S. Bhatia (3 shared papers)Yip‐Wah Chung (3 shared papers)Dong Li (1 shared paper)L. M. Keer (2 shared papers)Quanxin Guo (2 shared papers)M. E. Fine (1 shared paper)M. E. Fine (3 shared papers)
- Journals
- Journal of Electronic Packaging (3 papers)Tribology Transactions (2 papers)Surface and Coatings Technology (1 paper)Journal of Tribology (1 paper)MRS Proceedings (1 paper)
- Partner nations
- United States
In The Last Decade
Eric C. Cutiongco
12 papers receiving 455 citations
Peers
Comparison fields: 5 of 30
- Mechanics of Materials 358
- Mechanical Engineering 239
- Materials Chemistry 291
- Electrical and Electronic Engineering 188
- Aerospace Engineering 35
Countries citing papers authored by Eric C. Cutiongco
This map shows the geographic impact of Eric C. Cutiongco's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Eric C. Cutiongco with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Eric C. Cutiongco more than expected).
Fields of papers citing papers by Eric C. Cutiongco
This network shows the impact of papers produced by Eric C. Cutiongco. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Eric C. Cutiongco. The network helps show where Eric C. Cutiongco may publish in the future.
Co-authors
The 21 scholars most cited alongside Eric C. Cutiongco, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 1996 | 150 | |
| 2 | 1992 | 70 | |
| 3 | 1994 | 70 | |
| 4 | 1994 | 67 | |
| 5 | 1990 | 52 | |
| 6 | 1994 | 39 | |
| 7 | 1990 | 15 | |
| 8 | 1995 | 7 | |
| 9 | Tribological behavior of amorphous carbon nitride overcoats for magnetic thin-film rigid disks | 1995 | 3 |
| 10 | Fatigue of a near-eutectic lead-tin solder alloy for surface mount technology | 1991 | 3 |
| 11 | 2003 | 2 | |
| 12 | 2016 | 1 |
About Eric C. Cutiongco
Eric C. Cutiongco is a scholar working on Mechanics of Materials, Mechanical Engineering, Electrical and Electronic Engineering, Materials Chemistry and Civil and Structural Engineering, having authored 12 papers that have together received 479 indexed citations. Recurring topics across this work include Metal and Thin Film Mechanics (5 papers), Electronic Packaging and Soldering Technologies (5 papers), Diamond and Carbon-based Materials Research (4 papers), Adhesion, Friction, and Surface Interactions (3 papers), Lubricants and Their Additives (2 papers), Silicon and Solar Cell Technologies (1 paper), Fatigue and fracture mechanics (1 paper) and Material Properties and Applications (1 paper). The work is most often cited by research in Mechanics of Materials (358 citations), Mechanical Engineering (239 citations), Materials Chemistry (291 citations), Electrical and Electronic Engineering (188 citations) and Aerospace Engineering (35 citations). Eric C. Cutiongco has collaborated with scholars based in United States. Frequent co-authors include Yip-Wah Chung, Charanjit S. Bhatia, Yip‐Wah Chung, Dong Li, L. M. Keer, Quanxin Guo, M. E. Fine, M. E. Fine, Ming‐Show Wong and William D. Sproul. Their work appears in journals such as Journal of Electronic Packaging, Tribology Transactions, Surface and Coatings Technology, Journal of Tribology and MRS Proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.