De‐Shin Liu

44 papers and 344 indexed citations i.

De‐Shin Liu has authored 44 papers that have received a total of 344 indexed citations. This includes 18 papers in Electrical and Electronic Engineering, 18 papers in Mechanical Engineering and 11 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (12 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (8 papers). De‐Shin Liu is often cited by papers focused on Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (12 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (8 papers) and collaborates with scholars based in Taiwan, United States and India. De‐Shin Liu's co-authors include Pai-Chen Lin, Hong‐Tzong Yau, Meng-Kai Shih, Pay‐Yau Huang and Shaw‐Ruey Lyu and has published in prestigious journals such as Materials Science and Engineering A, Journal of Applied Mechanics and International Journal of Plasticity.