Dayananda Pai

681 citations
42 papers · 490 · h-index 14

Impact in

Papers in

Dayananda Pai

37 papers receiving 473 citations

Peers

Dayananda Pai
Comparison fields: 5 of 45
  • Polymers and Plastics 244
  • Mechanics of Materials 204
  • Mechanical Engineering 205
  • General Materials Science 17
  • Building and Construction 58
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Citations per field
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Citations per year

Countries citing papers authored by Dayananda Pai

Since Specialization
Citations

This map shows the geographic impact of Dayananda Pai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dayananda Pai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dayananda Pai more than expected).

Fields of papers citing papers by Dayananda Pai

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Dayananda Pai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dayananda Pai. The network helps show where Dayananda Pai may publish in the future.

Co-authors

The 16 scholars most cited alongside Dayananda Pai, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Dayananda Pai Line = papers co-authored together Dayananda Pai links everyone, so they are left out of the graph.

All Works

20 of 20 papers shown

Showing the 20 most-cited of 42 papers — load more, or switch the sort, to bring in the rest.

#Work
1 202138
2 202133
3 202431
4 202230
5 202328
6 202428
7 202128
8 202125
9 202217
10 202317
11 202017
12 202015
13 201914
14
APPLICATION OF RESPONSE SURFACE METHODOLOGY ON SURFACE ROUGHNESS IN GRINDING OF AEROSPACE MATERIALS (6061Al-15Vol%SiC25P)
201014
15 202313
16 202413
17 202113
18 202312
19 202411
20 202110

About Dayananda Pai

Dayananda Pai is a scholar working on Mechanical Engineering, Polymers and Plastics, Mechanics of Materials, Electrical and Electronic Engineering and Biomedical Engineering, having authored 42 papers that have together received 490 indexed citations. Recurring topics across this work include Natural Fiber Reinforced Composites (18 papers), Mechanical Behavior of Composites (16 papers), Advanced Machining and Optimization Techniques (7 papers), Advanced machining processes and optimization (7 papers), Fiber-reinforced polymer composites (7 papers), Advanced Surface Polishing Techniques (6 papers), Epoxy Resin Curing Processes (6 papers) and Structural Behavior of Reinforced Concrete (4 papers). The work is most often cited by research in Polymers and Plastics (244 citations), Mechanics of Materials (204 citations), Mechanical Engineering (205 citations), General Materials Science (17 citations) and Building and Construction (58 citations). Dayananda Pai has collaborated with scholars based in India. Frequent co-authors include G T Mahesha, B. Satish Shenoy, N H Padmaraj, Vishnu G. Nair, Y.N. Sudhakar, Shrikantha S. Rao, Raviraj Shetty, Ritesh Bhat, S. M. Kulkarni and Sathyashankara Sharma. Their work appears in journals such as Materials Research Express, Journal of Materials Research and Technology, Journal of Energy Chemistry, Chemical Engineering Journal Advances and Engineering Failure Analysis.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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