David Bušek
Impact in
- General Materials Science top 2%
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
Papers in
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- Electronic Packaging and Soldering Technologies 74
- 3D IC and TSV technologies 25
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- Advanced Welding Techniques Analysis 13
- Intermetallics and Advanced Alloy Properties 6
- Injection Molding Process and Properties 6
- Co-authors
- Karel Dušek (48 shared papers)Balázs Illés (33 shared papers)Attila Géczy (27 shared papers)Agata Skwarek (13 shared papers)Olivér Krammer (17 shared papers)Pavel Mach (15 shared papers)Petr Veselý (11 shared papers)Tamás Hurtony (7 shared papers)
In The Last Decade
David Bušek
80 papers receiving 654 citations
Peers
Comparison fields: 5 of 59
- General Materials Science 43
- Electrical and Electronic Engineering 534
- Mechanical Engineering 323
- Mechanics of Materials 102
- Automotive Engineering 43
Countries citing papers authored by David Bušek
This map shows the geographic impact of David Bušek's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David Bušek with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David Bušek more than expected).
Fields of papers citing papers by David Bušek
This network shows the impact of papers produced by David Bušek. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David Bušek. The network helps show where David Bušek may publish in the future.
Co-authors
The 25 scholars most cited alongside David Bušek, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 85 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 65 | |
| 2 | 2018 | 33 | |
| 3 | 2022 | 31 | |
| 4 | 2017 | 26 | |
| 5 | 2019 | 25 | |
| 6 | 2023 | 24 | |
| 7 | 2016 | 22 | |
| 8 | 2015 | 22 | |
| 9 | 2021 | 20 | |
| 10 | 2018 | 19 | |
| 11 | 2019 | 19 | |
| 12 | 2021 | 16 | |
| 13 | 2022 | 15 | |
| 14 | 2019 | 15 | |
| 15 | 2024 | 15 | |
| 16 | 2019 | 14 | |
| 17 | 2021 | 13 | |
| 18 | 2019 | 13 | |
| 19 | 2018 | 12 | |
| 20 | 2020 | 11 |
About David Bušek
David Bušek is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Biomedical Engineering and General Materials Science, having authored 85 papers that have together received 668 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (74 papers), 3D IC and TSV technologies (25 papers), Advanced Welding Techniques Analysis (13 papers), Metallurgical and Alloy Processes (10 papers), Smart Materials for Construction (7 papers), Advanced Sensor Technologies Research (7 papers), Intermetallics and Advanced Alloy Properties (6 papers) and Injection Molding Process and Properties (6 papers). The work is most often cited by research in General Materials Science (43 citations), Electrical and Electronic Engineering (534 citations), Mechanical Engineering (323 citations), Mechanics of Materials (102 citations) and Automotive Engineering (43 citations). David Bušek has collaborated with scholars based in Czechia, Hungary and Poland. Frequent co-authors include Karel Dušek, Balázs Illés, Attila Géczy, Agata Skwarek, Olivér Krammer, Pavel Mach, Petr Veselý, Tamás Hurtony, J. Starý and Bálint Medgyes. Their work appears in journals such as Materials, International Journal of Heat and Mass Transfer, Journal of Materials Science Materials in Electronics, Journal of Materials Processing Technology and Journal of Materials Research and Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.