Daniel May
Impact in
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- Thermography and Photoacoustic Techniques
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- Graphene research and applications
- Thermal properties of materials
Papers in
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- Thermography and Photoacoustic Techniques 11
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- Electronic Packaging and Soldering Technologies 13
- Integrated Circuits and Semiconductor Failure Analysis 4
- 3D IC and TSV technologies 4
- Silicon Carbide Semiconductor Technologies 4
- Co-authors
- Bernhard Wunderle (39 shared papers)Mohamad Abo Ras (27 shared papers)Frithjof B. Anders (3 shared papers)Corinna Grosse (10 shared papers)Guohong Li (2 shared papers)Eva Y. Andrei (2 shared papers)Jens Heilmann (3 shared papers)Jinhai Mao (2 shared papers)
- Journals
- Physical review. B. (3 papers)Microelectronics Reliability (2 papers)Microsystem Technologies (1 paper)IEEE photonics journal (1 paper)Sensors and Actuators A Physical (1 paper)
- Partner nations
- GermanyUnited StatesFrance
In The Last Decade
Daniel May
51 papers receiving 286 citations
Peers
Comparison fields: 5 of 46
- Mechanics of Materials 71
- Materials Chemistry 115
- Atomic and Molecular Physics, and Optics 77
- Electrical and Electronic Engineering 132
- Mechanical Engineering 66
Countries citing papers authored by Daniel May
This map shows the geographic impact of Daniel May's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daniel May with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daniel May more than expected).
Fields of papers citing papers by Daniel May
This network shows the impact of papers produced by Daniel May. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daniel May. The network helps show where Daniel May may publish in the future.
Co-authors
The 25 scholars most cited alongside Daniel May, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 57 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2018 | 44 | |
| 2 | 2017 | 30 | |
| 3 | 2018 | 18 | |
| 4 | 2014 | 13 | |
| 5 | 2018 | 12 | |
| 6 | 2014 | 11 | |
| 7 | 2020 | 9 | |
| 8 | 2016 | 9 | |
| 9 | 2014 | 9 | |
| 10 | 2018 | 9 | |
| 11 | 2019 | 8 | |
| 12 | 2024 | 8 | |
| 13 | 2018 | 7 | |
| 14 | 2014 | 6 | |
| 15 | 2020 | 6 | |
| 16 | 2020 | 6 | |
| 17 | 2006 | 6 | |
| 18 | 2016 | 6 | |
| 19 | 2018 | 5 | |
| 20 | Experimental and numerical reinvestigation for lifetime-estimation of plated through holes in printed circuit boards | 2011 | 4 |
About Daniel May
Daniel May is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry and Atomic and Molecular Physics, and Optics, having authored 57 papers that have together received 289 indexed citations. Recurring topics across this work include Thermal properties of materials (16 papers), Heat Transfer and Optimization (13 papers), Electronic Packaging and Soldering Technologies (13 papers), Thermography and Photoacoustic Techniques (11 papers), Heat Transfer and Boiling Studies (5 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers), 3D IC and TSV technologies (4 papers) and Silicon Carbide Semiconductor Technologies (4 papers). The work is most often cited by research in Mechanics of Materials (71 citations), Materials Chemistry (115 citations), Atomic and Molecular Physics, and Optics (77 citations), Electrical and Electronic Engineering (132 citations) and Mechanical Engineering (66 citations). Daniel May has collaborated with scholars based in Germany, United States and France. Frequent co-authors include Bernhard Wunderle, Mohamad Abo Ras, Frithjof B. Anders, Corinna Grosse, Guohong Li, Eva Y. Andrei, Jens Heilmann, Jinhai Mao, Yuhang Jiang and Guang‐Yu Guo. Their work appears in journals such as Physical review. B., Microelectronics Reliability, Microsystem Technologies, IEEE photonics journal and Sensors and Actuators A Physical.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.