Daniel I. Amey
Impact in
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- Electromagnetic Compatibility and Noise Suppression
- 3D IC and TSV technologies
- Microwave Engineering and Waveguides
- Electrical and Thermal Properties of Materials
- Electronic Packaging and Soldering Technologies
- Microwave Dielectric Ceramics Synthesis
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- Advanced Antenna and Metasurface Technologies
Papers in
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- 3D IC and TSV technologies 11
- Electrical and Thermal Properties of Materials 7
- Electronic Packaging and Soldering Technologies 7
- Microwave Dielectric Ceramics Synthesis 4
- Semiconductor materials and devices 4
- Electromagnetic Compatibility and Noise Suppression 3
- Microwave Engineering and Waveguides 2
- Semiconductor Lasers and Optical Devices 2
- Co-authors
- Can Akgün (2 shared papers)Rhonda Franklin (2 shared papers)S. Horowitz (12 shared papers)Madhavan Swaminathan (4 shared papers)A. Ege Engin (2 shared papers)Rao Tummala (4 shared papers)V. Sundaram (1 shared paper)J. Sosnowski (1 shared paper)
- Journals
- IEEE Transactions on Advanced Packaging (2 papers)Computer (1 paper)Journal of materials research/Pratt's guide to venture capital sources (1 paper)IEEE Transactions on Components Hybrids and Manufacturing Technology (2 papers)
- Partner nations
- United States
In The Last Decade
Daniel I. Amey
20 papers receiving 282 citations
Peers
Comparison fields: 5 of 72
- Electrical and Electronic Engineering 176
- Aerospace Engineering 57
- Instrumentation 7
- Medical Laboratory Technology 2
- Media Technology 11
Countries citing papers authored by Daniel I. Amey
This map shows the geographic impact of Daniel I. Amey's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daniel I. Amey with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daniel I. Amey more than expected).
Fields of papers citing papers by Daniel I. Amey
This network shows the impact of papers produced by Daniel I. Amey. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daniel I. Amey. The network helps show where Daniel I. Amey may publish in the future.
Co-authors
The 21 scholars most cited alongside Daniel I. Amey, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 24 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Proceedings of SPIE - The International Society for Optical Engineering | 2003 | 131 |
| 2 | 2007 | 25 | |
| 3 | 1983 | 23 | |
| 4 | 2008 | 19 | |
| 5 | 2002 | 18 | |
| 6 | 2003 | 11 | |
| 7 | Materials Performance At Frequencies Up To 20 Ghz | 1997 | 10 |
| 8 | 2002 | 10 | |
| 9 | Photoimageable Silver cofireable conductor compatible with 951 Green Tape | 1998 | 8 |
| 10 | 2002 | 8 | |
| 11 | 2003 | 6 | |
| 12 | High k LTCC system for high frequency applications | 2003 | 6 |
| 13 | 2002 | 4 | |
| 14 | 2002 | 3 | |
| 15 | Characterization of Low Loss LTCC Materials at 40 GHz | 1999 | 3 |
| 16 | 1977 | 3 | |
| 17 | Application of uniplanar structures for high frequency material characterization | 2003 | 3 |
| 18 | 2007 | 3 | |
| 19 | Design, Modeling and Characterization of Embedded Capacitors for Decoupling Applications | 2008 | 2 |
| 20 | 2002 | 2 |
About Daniel I. Amey
Daniel I. Amey is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, General Health Professions, Computational Mechanics and Philosophy, having authored 24 papers that have together received 300 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (11 papers), Electrical and Thermal Properties of Materials (7 papers), Electronic Packaging and Soldering Technologies (7 papers), Microwave Dielectric Ceramics Synthesis (4 papers), Semiconductor materials and devices (4 papers), Electromagnetic Compatibility and Noise Suppression (3 papers), Microwave Engineering and Waveguides (2 papers) and Semiconductor Lasers and Optical Devices (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (176 citations), Aerospace Engineering (57 citations), Instrumentation (7 citations), Medical Laboratory Technology (2 citations) and Media Technology (11 citations). Daniel I. Amey has collaborated with scholars based in United States. Frequent co-authors include Can Akgün, Rhonda Franklin, S. Horowitz, Madhavan Swaminathan, A. Ege Engin, Rao Tummala, V. Sundaram, J. Sosnowski, K. Srinivasan and Andrew London. Their work appears in journals such as IEEE Transactions on Advanced Packaging, Computer, Journal of materials research/Pratt's guide to venture capital sources and IEEE Transactions on Components Hybrids and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.