Daniel Henkel
Impact in
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- Mobile Ad Hoc Networks
- Opportunistic and Delay-Tolerant Networks
- Distributed Control Multi-Agent Systems
- Energy Efficient Wireless Sensor Networks
- Aerospace Engineering top 10%
- UAV Applications and Optimization
Papers in
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- Mobile Ad Hoc Networks 10
- Opportunistic and Delay-Tolerant Networks 10
- Cooperative Communication and Network Coding 4
- Energy Efficient Wireless Sensor Networks 3
- Wireless Networks and Protocols 3
- Co-authors
- Timothy X. Brown (9 shared papers)Cory Dixon (4 shared papers)Sheetalkumar Doshi (1 shared paper)Brian Argrow (1 shared paper)Xiaodong Li (1 shared paper)Jeffrey Burdick (1 shared paper)Brendan P. Croom (1 shared paper)Eric W. Frew (2 shared papers)
- Journals
- NDT & E International (1 paper)IISE Transactions (1 paper)Journal of Manufacturing Science and Engineering (1 paper)Additive manufacturing (1 paper)Journal of Vacuum Science & Technology A Vacuum Surfaces and Films (1 paper)
- Partner nations
- United StatesFranceGermany
In The Last Decade
Daniel Henkel
26 papers receiving 399 citations
Peers
Comparison fields: 5 of 50
- Computer Networks and Communications 231
- Aerospace Engineering 165
- Automotive Engineering 75
- Mechanical Engineering 110
- Industrial and Manufacturing Engineering 20
Countries citing papers authored by Daniel Henkel
This map shows the geographic impact of Daniel Henkel's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daniel Henkel with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daniel Henkel more than expected).
Fields of papers citing papers by Daniel Henkel
This network shows the impact of papers produced by Daniel Henkel. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daniel Henkel. The network helps show where Daniel Henkel may publish in the future.
Co-authors
The 20 scholars most cited alongside Daniel Henkel, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 27 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 129 | |
| 2 | 2018 | 103 | |
| 3 | 2008 | 26 | |
| 4 | 2006 | 18 | |
| 5 | 2006 | 18 | |
| 6 | 2007 | 17 | |
| 7 | 2008 | 16 | |
| 8 | 1991 | 13 | |
| 9 | 2011 | 12 | |
| 10 | 2011 | 11 | |
| 11 | 2006 | 9 | |
| 12 | 2021 | 9 | |
| 13 | 2008 | 6 | |
| 14 | 2020 | 6 | |
| 15 | 1996 | 5 | |
| 16 | 2007 | 4 | |
| 17 | 2020 | 3 | |
| 18 | Structure and properties of engineering materials / Daniel Henkel and Alan W. Pense | 2002 | 2 |
| 19 | 1994 | 2 | |
| 20 | 2016 | 1 |
About Daniel Henkel
Daniel Henkel is a scholar working on Computer Networks and Communications, Language and Linguistics, Mechanical Engineering, Automotive Engineering and Artificial Intelligence, having authored 27 papers that have together received 416 indexed citations. Recurring topics across this work include Mobile Ad Hoc Networks (10 papers), Opportunistic and Delay-Tolerant Networks (10 papers), Cooperative Communication and Network Coding (4 papers), Natural Language Processing Techniques (3 papers), Energy Efficient Wireless Sensor Networks (3 papers), Additive Manufacturing Materials and Processes (3 papers), Additive Manufacturing and 3D Printing Technologies (3 papers) and Wireless Networks and Protocols (3 papers). The work is most often cited by research in Computer Networks and Communications (231 citations), Aerospace Engineering (165 citations), Automotive Engineering (75 citations), Mechanical Engineering (110 citations) and Industrial and Manufacturing Engineering (20 citations). Daniel Henkel has collaborated with scholars based in United States, France and Germany. Frequent co-authors include Timothy X. Brown, Cory Dixon, Sheetalkumar Doshi, Brian Argrow, Xiaodong Li, Jeffrey Burdick, Brendan P. Croom, Eric W. Frew, James Wood and Mathias Kretschmer. Their work appears in journals such as NDT & E International, IISE Transactions, Journal of Manufacturing Science and Engineering, Additive manufacturing and Journal of Vacuum Science & Technology A Vacuum Surfaces and Films.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.