Daehan Kwon
Impact in
- Bioengineering top 10%
- Analytical Chemistry and Sensors
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- Electrochemical Analysis and Applications
Papers in
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- Advancements in PLL and VCO Technologies 8
- Low-power high-performance VLSI design 5
- Radio Frequency Integrated Circuit Design 4
- Electromagnetic Compatibility and Noise Suppression 4
- Microwave Engineering and Waveguides 2
- 3D IC and TSV technologies 2
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- VLSI and Analog Circuit Testing 2
- Co-authors
- Sungwoo Hwang (2 shared papers)Juhwan Lim (2 shared papers)Soo-Won Kim (1 shared paper)Jae-Sung Rieh (1 shared paper)M.R. Haskard (1 shared paper)Dennis Mulcahy (1 shared paper)Kyu‐Dong Hwang (3 shared papers)Joohwan Cho (4 shared papers)
- Journals
- IEEE Journal of Solid-State Circuits (2 papers)Sensors and Actuators B Chemical (1 paper)IEEE Transactions on Circuits & Systems II Express Briefs (1 paper)IEEE Transactions on Advanced Packaging (1 paper)IEEE Transactions on Components and Packaging Technologies (1 paper)
- Partner nations
- South KoreaUnited StatesAustralia
In The Last Decade
Daehan Kwon
11 papers receiving 181 citations
Peers
Comparison fields: 5 of 29
- Bioengineering 51
- Electrochemistry 21
- Electrical and Electronic Engineering 167
- Hardware and Architecture 16
- Biomedical Engineering 39
Countries citing papers authored by Daehan Kwon
This map shows the geographic impact of Daehan Kwon's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daehan Kwon with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daehan Kwon more than expected).
Fields of papers citing papers by Daehan Kwon
This network shows the impact of papers produced by Daehan Kwon. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daehan Kwon. The network helps show where Daehan Kwon may publish in the future.
Co-authors
The 25 scholars most cited alongside Daehan Kwon, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2005 | 60 | |
| 2 | 1997 | 53 | |
| 3 | 2018 | 16 | |
| 4 | 2003 | 15 | |
| 5 | 2016 | 13 | |
| 6 | 2022 | 13 | |
| 7 | Wide-range fast-lock duty-cycle corrector with offset-tolerant duty-cycle detection scheme for 54nm 7Gb/s GDDR5 DRAM interface | 2009 | 12 |
| 8 | 2002 | 4 | |
| 9 | 2021 | 3 | |
| 10 | 2021 | 2 | |
| 11 | 2008 | 2 | |
| 12 | 2017 | 0 | |
| 13 | 2025 | 0 |
About Daehan Kwon
Daehan Kwon is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Computer Networks and Communications, Information Systems and Artificial Intelligence, having authored 13 papers that have together received 193 indexed citations. Recurring topics across this work include Advancements in PLL and VCO Technologies (8 papers), Low-power high-performance VLSI design (5 papers), Radio Frequency Integrated Circuit Design (4 papers), Electromagnetic Compatibility and Noise Suppression (4 papers), VLSI and Analog Circuit Testing (2 papers), Microwave Engineering and Waveguides (2 papers), 3D IC and TSV technologies (2 papers) and Air Traffic Management and Optimization (1 paper). The work is most often cited by research in Bioengineering (51 citations), Electrochemistry (21 citations), Electrical and Electronic Engineering (167 citations), Hardware and Architecture (16 citations) and Biomedical Engineering (39 citations). Daehan Kwon has collaborated with scholars based in South Korea, United States and Australia. Frequent co-authors include Sungwoo Hwang, Juhwan Lim, Soo-Won Kim, Jae-Sung Rieh, M.R. Haskard, Dennis Mulcahy, Kyu‐Dong Hwang, Joohwan Cho, Dongsuk Kang and Jung‐Hoon Chun. Their work appears in journals such as IEEE Journal of Solid-State Circuits, Sensors and Actuators B Chemical, IEEE Transactions on Circuits & Systems II Express Briefs, IEEE Transactions on Advanced Packaging and IEEE Transactions on Components and Packaging Technologies.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.