D. Henry
Impact in
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- 3D IC and TSV technologies
- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Semiconductor Lasers and Optical Devices
- Thin-Film Transistor Technologies
- Advanced MEMS and NEMS Technologies
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- GaN-based semiconductor devices and materials
Papers in
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- 3D IC and TSV technologies 5
- Electronic Packaging and Soldering Technologies 2
- VLSI and FPGA Design Techniques 1
- Advanced DC-DC Converters 1
- Co-authors
- N. Sillon (2 shared papers)Philip R. LeDuc (1 shared paper)L. Di Cioccio (1 shared paper)François Templier (1 shared paper)Alastair Basden (1 shared paper)C. Gillot (1 shared paper)Tim Morris (1 shared paper)Damien Gratadour (1 shared paper)
- Journals
- Astronomy and Astrophysics (1 paper)Microscopy and Microanalysis (1 paper)Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) (1 paper)
- Partner nations
- FranceUnited StatesUnited Kingdom
In The Last Decade
D. Henry
6 papers receiving 68 citations
Peers
Comparison fields: 5 of 22
- Electrical and Electronic Engineering 62
- Condensed Matter Physics 11
- Atomic and Molecular Physics, and Optics 13
- Hardware and Architecture 3
- Automotive Engineering 5
Countries citing papers authored by D. Henry
This map shows the geographic impact of D. Henry's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Henry with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Henry more than expected).
Fields of papers citing papers by D. Henry
This network shows the impact of papers produced by D. Henry. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Henry. The network helps show where D. Henry may publish in the future.
Co-authors
The 21 scholars most cited alongside D. Henry, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 38 | |
| 2 | 2016 | 16 | |
| 3 | 2016 | 10 | |
| 4 | 2009 | 5 | |
| 5 | 2003 | 4 | |
| 6 | 2008 | 1 | |
| 7 | 2017 | 0 |
About D. Henry
D. Henry is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Automotive Engineering, Structural Biology and Condensed Matter Physics, having authored 7 papers that have together received 74 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (5 papers), Electronic Packaging and Soldering Technologies (2 papers), VLSI and FPGA Design Techniques (1 paper), Adaptive optics and wavefront sensing (1 paper), GaN-based semiconductor devices and materials (1 paper), Advanced Electron Microscopy Techniques and Applications (1 paper), Advanced DC-DC Converters (1 paper) and Electron and X-Ray Spectroscopy Techniques (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (62 citations), Condensed Matter Physics (11 citations), Atomic and Molecular Physics, and Optics (13 citations), Hardware and Architecture (3 citations) and Automotive Engineering (5 citations). D. Henry has collaborated with scholars based in France, United States and United Kingdom. Frequent co-authors include N. Sillon, Philip R. LeDuc, L. Di Cioccio, François Templier, Alastair Basden, C. Gillot, Tim Morris, Damien Gratadour, Carlos Correia and Richard M. Myers. Their work appears in journals such as Astronomy and Astrophysics, Microscopy and Microanalysis and Additional Conferences (Device Packaging HiTEC HiTEN & CICMT).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.