C.P. Wang
Impact in
- General Materials Science top 0.1%
- Metallurgical and Alloy Processes
- Mechanical Engineering top 2%
- Intermetallics and Advanced Alloy Properties
- High Temperature Alloys and Creep
- Thermodynamic and Structural Properties of Metals and Alloys
- High Entropy Alloys Studies
Papers in
-
- Intermetallics and Advanced Alloy Properties 31
- Thermodynamic and Structural Properties of Metals and Alloys 22
- High Temperature Alloys and Creep 13
-
- Electronic Packaging and Soldering Technologies 11
- Co-authors
- Xingjun Liu (50 shared papers)K. Ishida (20 shared papers)Ryosuke Kainuma (11 shared papers)Ikuo Ohnuma (9 shared papers)Jiajia Han (7 shared papers)Rongpei Shi (1 shared paper)Daniel Wheeler (1 shared paper)Weiwei Xu (4 shared papers)
- Journals
- Journal of Alloys and Compounds (28 papers)Calphad (20 papers)Journal of Nuclear Materials (8 papers)Intermetallics (6 papers)Journal of Electronic Materials (4 papers)
- Partner nations
- ChinaJapanUnited States
In The Last Decade
C.P. Wang
118 papers receiving 1.8k citations
Peers
Comparison fields: 5 of 101
- General Materials Science 273
- Mechanical Engineering 1.1k
- Condensed Matter Physics 249
- Materials Chemistry 666
- Aerospace Engineering 339
Countries citing papers authored by C.P. Wang
This map shows the geographic impact of C.P. Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C.P. Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C.P. Wang more than expected).
Fields of papers citing papers by C.P. Wang
This network shows the impact of papers produced by C.P. Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C.P. Wang. The network helps show where C.P. Wang may publish in the future.
Co-authors
The 25 scholars most cited alongside C.P. Wang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 132 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 160 | |
| 2 | 2020 | 110 | |
| 3 | 2013 | 75 | |
| 4 | 2017 | 67 | |
| 5 | 2012 | 58 | |
| 6 | 2009 | 56 | |
| 7 | 2008 | 50 | |
| 8 | 2004 | 49 | |
| 9 | 2008 | 41 | |
| 10 | 2007 | 41 | |
| 11 | 2007 | 38 | |
| 12 | 2012 | 35 | |
| 13 | 2008 | 35 | |
| 14 | 2009 | 34 | |
| 15 | 2014 | 34 | |
| 16 | 2007 | 26 | |
| 17 | 2008 | 26 | |
| 18 | 2007 | 25 | |
| 19 | 2019 | 25 | |
| 20 | 2013 | 23 |
About C.P. Wang
C.P. Wang is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, General Materials Science, Condensed Matter Physics and Electronic, Optical and Magnetic Materials, having authored 132 papers that have together received 1.9k indexed citations. Recurring topics across this work include Metallurgical and Alloy Processes (36 papers), Intermetallics and Advanced Alloy Properties (31 papers), Rare-earth and actinide compounds (30 papers), Thermodynamic and Structural Properties of Metals and Alloys (22 papers), Magnetic Properties of Alloys (14 papers), High Temperature Alloys and Creep (13 papers), Electronic Packaging and Soldering Technologies (11 papers) and Underwater Vehicles and Communication Systems (6 papers). The work is most often cited by research in General Materials Science (273 citations), Mechanical Engineering (1.1k citations), Condensed Matter Physics (249 citations), Materials Chemistry (666 citations) and Aerospace Engineering (339 citations). C.P. Wang has collaborated with scholars based in China, Japan and United States. Frequent co-authors include Xingjun Liu, K. Ishida, Ryosuke Kainuma, Ikuo Ohnuma, Jiajia Han, Rongpei Shi, Daniel Wheeler, Weiwei Xu, Yong Lu and Shuiyuan Yang. Their work appears in journals such as Journal of Alloys and Compounds, Calphad, Journal of Nuclear Materials, Intermetallics and Journal of Electronic Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.