Chingfu Tsou
Impact in
- Condensed Matter Physics top 10%
- GaN-based semiconductor devices and materials
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- Advanced MEMS and NEMS Technologies
- 3D IC and TSV technologies
- Thin-Film Transistor Technologies
- Electronic Packaging and Soldering Technologies
Papers in
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- Advanced MEMS and NEMS Technologies 17
- Electrowetting and Microfluidic Technologies 9
- Thin-Film Transistor Technologies 8
- Semiconductor Lasers and Optical Devices 7
- 3D IC and TSV technologies 7
-
- Advanced optical system design 9
- Advanced Sensor and Energy Harvesting Materials 7
- Co-authors
- Cheng‐Han Huang (7 shared papers)Weileun Fang (9 shared papers)Kuo‐Ning Chiang (3 shared papers)Bruce C. S. Chou (1 shared paper)Ming‐Chuen Yip (1 shared paper)Hsing-Cheng Chang (2 shared papers)Shuenn-Yuh Lee (1 shared paper)Gia-Shing Shieh (1 shared paper)
In The Last Decade
Chingfu Tsou
57 papers receiving 474 citations
Peers
Comparison fields: 5 of 61
- Condensed Matter Physics 82
- Electrical and Electronic Engineering 311
- Biomedical Engineering 233
- Surfaces, Coatings and Films 18
- Atomic and Molecular Physics, and Optics 77
Countries citing papers authored by Chingfu Tsou
This map shows the geographic impact of Chingfu Tsou's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chingfu Tsou with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chingfu Tsou more than expected).
Fields of papers citing papers by Chingfu Tsou
This network shows the impact of papers produced by Chingfu Tsou. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chingfu Tsou. The network helps show where Chingfu Tsou may publish in the future.
Co-authors
The 25 scholars most cited alongside Chingfu Tsou, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 60 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2006 | 63 | |
| 2 | 2014 | 54 | |
| 3 | 2017 | 24 | |
| 4 | 2005 | 22 | |
| 5 | On the Determination of Thermal Expansion Coefficient of Thermal Oxide | 2005 | 18 |
| 6 | 2014 | 18 | |
| 7 | 2005 | 16 | |
| 8 | 2014 | 15 | |
| 9 | 2008 | 15 | |
| 10 | 2019 | 15 | |
| 11 | 2001 | 12 | |
| 12 | 2006 | 11 | |
| 13 | 2006 | 10 | |
| 14 | 2013 | 9 | |
| 15 | 2006 | 9 | |
| 16 | 2013 | 9 | |
| 17 | 2016 | 9 | |
| 18 | 2006 | 9 | |
| 19 | 2014 | 8 | |
| 20 | 2021 | 8 |
About Chingfu Tsou
Chingfu Tsou is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Atomic and Molecular Physics, and Optics, Condensed Matter Physics and Mechanics of Materials, having authored 60 papers that have together received 484 indexed citations. Recurring topics across this work include Advanced MEMS and NEMS Technologies (17 papers), GaN-based semiconductor devices and materials (11 papers), Electrowetting and Microfluidic Technologies (9 papers), Advanced optical system design (9 papers), Thin-Film Transistor Technologies (8 papers), Advanced Sensor and Energy Harvesting Materials (7 papers), Semiconductor Lasers and Optical Devices (7 papers) and 3D IC and TSV technologies (7 papers). The work is most often cited by research in Condensed Matter Physics (82 citations), Electrical and Electronic Engineering (311 citations), Biomedical Engineering (233 citations), Surfaces, Coatings and Films (18 citations) and Atomic and Molecular Physics, and Optics (77 citations). Chingfu Tsou has collaborated with scholars based in Taiwan and France. Frequent co-authors include Cheng‐Han Huang, Weileun Fang, Kuo‐Ning Chiang, Bruce C. S. Chou, Ming‐Chuen Yip, Hsing-Cheng Chang, Shuenn-Yuh Lee, Gia-Shing Shieh, Chou‐Ching K. Lin and Yu‐Sheng Huang. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Sensors and Actuators A Physical, IEEE Photonics Technology Letters, Journal of Microelectromechanical Systems and Journal of Micromechanics and Microengineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.