Cai‐Fu Li
Impact in
- Biomaterials top 2%
- Magnesium Alloys: Properties and Applications
- Mechanical Engineering top 2%
- Aluminum Alloys Composites Properties
Papers in
-
- Electronic Packaging and Soldering Technologies 35
- 3D IC and TSV technologies 18
- Nanomaterials and Printing Technologies 17
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- Intermetallics and Advanced Alloy Properties 9
- Advanced Welding Techniques Analysis 7
- Co-authors
- Zhi‐Quan Liu (30 shared papers)Dejun Sun (6 shared papers)Katsuaki Suganuma (22 shared papers)Wanli Li (13 shared papers)Chuantong Chen (10 shared papers)Jinting Jiu (11 shared papers)Jian Xu (4 shared papers)Jian Xu (1 shared paper)
- Journals
- Journal of Alloys and Compounds (7 papers)Journal of Materials Science Materials in Electronics (4 papers)Fuel (4 papers)ACS Applied Materials & Interfaces (4 papers)Microelectronics Reliability (3 papers)
- Partner nations
- ChinaJapanUnited States
In The Last Decade
Cai‐Fu Li
89 papers receiving 2.7k citations
Cai‐Fu Li's Hit Papers
Peers
Comparison fields: 5 of 105
- Biomaterials 411
- Mechanical Engineering 1.1k
- Materials Chemistry 941
- Electrical and Electronic Engineering 992
- Metals and Alloys 39
Countries citing papers authored by Cai‐Fu Li
This map shows the geographic impact of Cai‐Fu Li's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Cai‐Fu Li with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Cai‐Fu Li more than expected).
Fields of papers citing papers by Cai‐Fu Li
This network shows the impact of papers produced by Cai‐Fu Li. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Cai‐Fu Li. The network helps show where Cai‐Fu Li may publish in the future.
Co-authors
The 25 scholars most cited alongside Cai‐Fu Li, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 89 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Development of low-alloyed and rare-earth-free magnesium alloys having ultra-high strength Hit paper breakdown → | 2018 | 378 |
| 2 | 2006 | 266 | |
| 3 | 2018 | 110 | |
| 4 | 2008 | 105 | |
| 5 | 2017 | 84 | |
| 6 | 2009 | 80 | |
| 7 | 2008 | 78 | |
| 8 | 2016 | 70 | |
| 9 | 2016 | 61 | |
| 10 | 2010 | 60 | |
| 11 | 2009 | 59 | |
| 12 | 2010 | 58 | |
| 13 | 2017 | 57 | |
| 14 | 2015 | 56 | |
| 15 | 2021 | 56 | |
| 16 | 2019 | 54 | |
| 17 | 2017 | 52 | |
| 18 | 2021 | 50 | |
| 19 | 2019 | 49 | |
| 20 | 2012 | 41 |
About Cai‐Fu Li
Cai‐Fu Li is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, Biomedical Engineering and Electronic, Optical and Magnetic Materials, having authored 89 papers that have together received 2.7k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (35 papers), 3D IC and TSV technologies (18 papers), Nanomaterials and Printing Technologies (17 papers), Advanced Sensor and Energy Harvesting Materials (11 papers), Intermetallics and Advanced Alloy Properties (9 papers), Advanced Welding Techniques Analysis (7 papers), Pickering emulsions and particle stabilization (7 papers) and Chemical Looping and Thermochemical Processes (7 papers). The work is most often cited by research in Biomaterials (411 citations), Mechanical Engineering (1.1k citations), Materials Chemistry (941 citations), Electrical and Electronic Engineering (992 citations) and Metals and Alloys (39 citations). Cai‐Fu Li has collaborated with scholars based in China, Japan and United States. Frequent co-authors include Zhi‐Quan Liu, Dejun Sun, Katsuaki Suganuma, Wanli Li, Chuantong Chen, Jinting Jiu, Jian Xu, Jian Xu, Qian Liu and Shijo Nagao. Their work appears in journals such as Journal of Alloys and Compounds, Journal of Materials Science Materials in Electronics, Fuel, ACS Applied Materials & Interfaces and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.