Brian J. Simonds

1.4k citations
60 papers · 1.0k · h-index 17

Impact in

    • Additive Manufacturing and 3D Printing Technologies
    • Additive Manufacturing Materials and Processes
    • Welding Techniques and Residual Stresses
    • High Entropy Alloys Studies

Papers in

Brian J. Simonds

59 papers receiving 992 citations

Peers

Brian J. Simonds
Comparison fields: 5 of 60
  • Automotive Engineering 222
  • Mechanical Engineering 579
  • Computational Mechanics 183
  • Electrical and Electronic Engineering 325
  • Industrial and Manufacturing Engineering 55
Replace Guglielmo Vastola with:
Guglielmo Vastola Singapore
Frank Brückner Germany
Shuai Wu China
А. В. Филиппов Russia
N. S. Tsai United States
Yufeng Huang Taiwan
Steve D. Sharples United Kingdom
Frank M. Gerner United States
Daniele Rosato Germany
Richard E. Ricker United States
Brian J. Simonds relative to Guglielmo Vastola Singapore Guglielmo Vastola's profile →
Citations per field
00.5×1.5×1.9×
Guglielmo Vastola · 1×
Citations per year

Countries citing papers authored by Brian J. Simonds

Since Specialization
Citations

This map shows the geographic impact of Brian J. Simonds's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Brian J. Simonds with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Brian J. Simonds more than expected).

Fields of papers citing papers by Brian J. Simonds

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Brian J. Simonds. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Brian J. Simonds. The network helps show where Brian J. Simonds may publish in the future.

Co-authors

The 25 scholars most cited alongside Brian J. Simonds, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Brian J. Simonds Line = papers co-authored together Brian J. Simonds links everyone, so they are left out of the graph.

All Works

20 of 20 papers shown

Showing the 20 most-cited of 60 papers — load more, or switch the sort, to bring in the rest.

#Work
1 202289
2 202186
3 202076
4 201972
5 200672
6 201867
7 202157
8 201739
9 200834
10 201531
11 200730
12 202029
13 201328
14 202026
15 201725
16 201318
17 201716
18 201713
19 200613
20 201513

About Brian J. Simonds

Brian J. Simonds is a scholar working on Electrical and Electronic Engineering, Materials Chemistry, Mechanical Engineering, Computational Mechanics and Biomedical Engineering, having authored 60 papers that have together received 1.0k indexed citations. Recurring topics across this work include Additive Manufacturing Materials and Processes (17 papers), Welding Techniques and Residual Stresses (16 papers), Laser Material Processing Techniques (14 papers), Quantum Dots Synthesis And Properties (12 papers), Chalcogenide Semiconductor Thin Films (11 papers), Silicon Nanostructures and Photoluminescence (10 papers), Thin-Film Transistor Technologies (10 papers) and Advanced Semiconductor Detectors and Materials (7 papers). The work is most often cited by research in Automotive Engineering (222 citations), Mechanical Engineering (579 citations), Computational Mechanics (183 citations), Electrical and Electronic Engineering (325 citations) and Industrial and Manufacturing Engineering (55 citations). Brian J. Simonds has collaborated with scholars based in United States, Australia and China. Frequent co-authors include Tao Sun, Paul Williams, Neil M. Zimmerman, Jeffrey W. Sowards, Cang Zhao, E. Hourdakis, Saad A. Khairallah, Alexandra B. Artusio‐Glimpse, Gernot Pottlacher and Niranjan D. Parab. Their work appears in journals such as Applied Physics Letters, Journal of Applied Physics, Physical Review Applied, Materials Science in Semiconductor Processing and AIP Advances.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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