Brian Curran
Impact in
- Hardware and Architecture top 2%
- Parallel Computing and Optimization Techniques
- VLSI and Analog Circuit Testing
- Computational Mathematics top 10%
Papers in
-
- Parallel Computing and Optimization Techniques 17
- Embedded Systems Design Techniques 7
- VLSI and Analog Circuit Testing 6
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- Low-power high-performance VLSI design 16
- Electromagnetic Compatibility and Noise Suppression 12
- 3D IC and TSV technologies 9
- Microwave Engineering and Waveguides 8
- Co-authors
- Ivan Ndip (18 shared papers)H. Reichl (10 shared papers)Stephan Guttowski (7 shared papers)Y.H. Chan (7 shared papers)Bradley D. McCredie (2 shared papers)Sean M. Carey (3 shared papers)Leon Sigal (6 shared papers)Eric J. Fluhr (2 shared papers)
- Journals
- IBM Journal of Research and Development (8 papers)IEEE Transactions on Microwave Theory and Techniques (2 papers)IEEE Journal of Solid-State Circuits (2 papers)Proceedings of the IEEE (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)
- Partner nations
- United StatesGermanyJapan
In The Last Decade
Brian Curran
49 papers receiving 911 citations
Peers
Comparison fields: 5 of 61
- Hardware and Architecture 378
- Computational Mathematics 10
- Electrical and Electronic Engineering 703
- Computer Vision and Pattern Recognition 159
- Computer Networks and Communications 155
Countries citing papers authored by Brian Curran
This map shows the geographic impact of Brian Curran's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Brian Curran with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Brian Curran more than expected).
Fields of papers citing papers by Brian Curran
This network shows the impact of papers produced by Brian Curran. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Brian Curran. The network helps show where Brian Curran may publish in the future.
Co-authors
The 25 scholars most cited alongside Brian Curran, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 52 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2021 | 94 | |
| 2 | 2007 | 92 | |
| 3 | 2018 | 79 | |
| 4 | 2021 | 58 | |
| 5 | 1997 | 49 | |
| 6 | 2020 | 49 | |
| 7 | 1997 | 45 | |
| 8 | 2020 | 37 | |
| 9 | 2010 | 31 | |
| 10 | 2018 | 30 | |
| 11 | 2021 | 26 | |
| 12 | Modeling and quantification of conventional and coax-TSVs for RF applications | 2009 | 25 |
| 13 | 1997 | 23 | |
| 14 | 2012 | 23 | |
| 15 | 2015 | 22 | |
| 16 | 2011 | 22 | |
| 17 | 2015 | 21 | |
| 18 | 2015 | 21 | |
| 19 | 2006 | 17 | |
| 20 | 2009 | 17 |
About Brian Curran
Brian Curran is a scholar working on Hardware and Architecture, Electrical and Electronic Engineering, Computer Networks and Communications, Aerospace Engineering and Computer Vision and Pattern Recognition, having authored 52 papers that have together received 965 indexed citations. Recurring topics across this work include Parallel Computing and Optimization Techniques (17 papers), Low-power high-performance VLSI design (16 papers), Electromagnetic Compatibility and Noise Suppression (12 papers), 3D IC and TSV technologies (9 papers), Microwave Engineering and Waveguides (8 papers), Embedded Systems Design Techniques (7 papers), Interconnection Networks and Systems (7 papers) and VLSI and Analog Circuit Testing (6 papers). The work is most often cited by research in Hardware and Architecture (378 citations), Computational Mathematics (10 citations), Electrical and Electronic Engineering (703 citations), Computer Vision and Pattern Recognition (159 citations) and Computer Networks and Communications (155 citations). Brian Curran has collaborated with scholars based in United States, Germany and Japan. Frequent co-authors include Ivan Ndip, H. Reichl, Stephan Guttowski, Y.H. Chan, Bradley D. McCredie, Sean M. Carey, Leon Sigal, Eric J. Fluhr, Greg A. Northrop and Klaus‐Dieter Lang. Their work appears in journals such as IBM Journal of Research and Development, IEEE Transactions on Microwave Theory and Techniques, IEEE Journal of Solid-State Circuits, Proceedings of the IEEE and IEEE Transactions on Components Packaging and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.