Bite Zhou
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Mechanical Engineering top 10%
- Advanced Welding Techniques Analysis
- Aluminum Alloys Composites Properties
- Intermetallics and Advanced Alloy Properties
Papers in
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- Electronic Packaging and Soldering Technologies 19
- 3D IC and TSV technologies 13
- Integrated Circuits and Semiconductor Failure Analysis 7
-
- Aluminum Alloy Microstructure Properties 9
- Co-authors
- Thomas R. Bieler (18 shared papers)Tae-Kyu Lee (12 shared papers)Quan Zhou (2 shared papers)Farhang Pourboghrat (2 shared papers)A. Zamiri (2 shared papers)Wenjun Liu (1 shared paper)Abhijit Dasgupta (2 shared papers)Kuo-Chuan Liu (3 shared papers)
- Journals
- Journal of Electronic Materials (14 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)Michigan State University Libraries (1 paper)
- Partner nations
- United StatesChinaTaiwan
In The Last Decade
Bite Zhou
20 papers receiving 519 citations
Peers
Comparison fields: 5 of 19
- Electrical and Electronic Engineering 501
- Mechanical Engineering 321
- Aerospace Engineering 142
- Mechanics of Materials 129
- General Materials Science 12
Countries citing papers authored by Bite Zhou
This map shows the geographic impact of Bite Zhou's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bite Zhou with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bite Zhou more than expected).
Fields of papers citing papers by Bite Zhou
This network shows the impact of papers produced by Bite Zhou. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bite Zhou. The network helps show where Bite Zhou may publish in the future.
Co-authors
The 16 scholars most cited alongside Bite Zhou, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2011 | 99 | |
| 2 | 2010 | 75 | |
| 3 | 2010 | 59 | |
| 4 | 2009 | 57 | |
| 5 | 2015 | 42 | |
| 6 | 2012 | 31 | |
| 7 | 2016 | 22 | |
| 8 | 2013 | 22 | |
| 9 | 2011 | 21 | |
| 10 | 2011 | 20 | |
| 11 | 2012 | 15 | |
| 12 | 2012 | 14 | |
| 13 | 2011 | 13 | |
| 14 | 2015 | 10 | |
| 15 | 2011 | 9 | |
| 16 | 2014 | 9 | |
| 17 | 2012 | 8 | |
| 18 | 2011 | 7 | |
| 19 | 2010 | 1 | |
| 20 | 2014 | 1 |
About Bite Zhou
Bite Zhou is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering, Mechanical Engineering, Mechanics of Materials and Materials Chemistry, having authored 20 papers that have together received 535 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (13 papers), Aluminum Alloy Microstructure Properties (9 papers), Integrated Circuits and Semiconductor Failure Analysis (7 papers), Metallurgy and Material Forming (3 papers), Microstructure and mechanical properties (2 papers), Advanced Welding Techniques Analysis (2 papers) and Aluminum Alloys Composites Properties (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (501 citations), Mechanical Engineering (321 citations), Aerospace Engineering (142 citations), Mechanics of Materials (129 citations) and General Materials Science (12 citations). Bite Zhou has collaborated with scholars based in United States, China and Taiwan. Frequent co-authors include Thomas R. Bieler, Tae-Kyu Lee, Quan Zhou, Farhang Pourboghrat, A. Zamiri, Wenjun Liu, Abhijit Dasgupta, Kuo-Chuan Liu, Govindarajan Muralidharan and Bo Liu. Their work appears in journals such as Journal of Electronic Materials, IEEE Transactions on Components Packaging and Manufacturing Technology and Michigan State University Libraries.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.