A.P. Lanzetta

5 papers and 41 indexed citations i.

A.P. Lanzetta has authored 5 papers that have received a total of 41 indexed citations. This includes 4 papers in Electrical and Electronic Engineering, 1 paper in Computer Networks and Communications and 1 paper in Hardware and Architecture. The topics of these papers are Electromagnetic Compatibility and Noise Suppression (4 papers), 3D IC and TSV technologies (3 papers) and Electronic Packaging and Soldering Technologies (2 papers). A.P. Lanzetta is often cited by papers focused on Electromagnetic Compatibility and Noise Suppression (4 papers), 3D IC and TSV technologies (3 papers) and Electronic Packaging and Soldering Technologies (2 papers) and collaborates with scholars based in United States. A.P. Lanzetta's co-authors include C.W. Surovic, P. Coteus, A. Deutsch, Todd Takken and G.V. Kopcsay and has published in prestigious journals such as IBM Journal of Research and Development, IEEE Transactions on Advanced Packaging and IEEE Transactions on Components Packaging and Manufacturing Technology Part B.