IEEE Transactions on Components Packaging and Manufacturing Technology Part A

398 papers and 6.8k indexed citations i.

About

The 398 papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part A in the last decades have received a total of 6.8k indexed citations. Papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part A usually cover Electrical and Electronic Engineering (269 papers), Mechanical Engineering (170 papers) and Mechanics of Materials (84 papers) specifically the topics of Electronic Packaging and Soldering Technologies (141 papers), 3D IC and TSV technologies (75 papers) and Electrical Contact Performance and Analysis (66 papers). The most active scholars publishing in IEEE Transactions on Components Packaging and Manufacturing Technology Part A are Paul G. Slade, Andrew Kusiak, E. Suhir, F.N. Masana, Masakazu Nakamura, M. Lindmayer, M. Braunović, Clemens Lasance, J.W. McBride and Kyung-Wook Paik.

In The Last Decade

Fields of papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

This network shows the specialization of papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part A. Nodes represent fields, and links connect fields that are likely to share authors.

Countries where authors publish in IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Since Specialization
Total citations of papers

This map shows the geographic distribution of research published in IEEE Transactions on Components Packaging and Manufacturing Technology Part A. It shows the number of citations received by papers published by authors working in each country. You can also color the map by specialization and compare the number of papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part A with the expected number of papers based on a country's size and research output (numbers larger than one mean the country's share of papers is larger than expected).

Rankless by CCL
2025