IEEE Transactions on Components Packaging and Manufacturing Technology Part A
About
The 398 papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part A in the last decades have received a total of 6.7k indexed citations.
Papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part A usually cover Electrical and Electronic Engineering (269 papers), Mechanical Engineering (170 papers) and Mechanics of Materials (84 papers) specifically the topics of Electronic Packaging and Soldering Technologies (141 papers), 3D IC and TSV technologies (75 papers) and Electrical Contact Performance and Analysis (66 papers). The most active scholars publishing in IEEE Transactions on Components Packaging and Manufacturing Technology Part A are W. Rieder, K. Sawa, J.W. McBride, Avram Bar‐Cohen and Michael Pecht.
In The Last Decade
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