Yu‐Wei Lin
About
Yu‐Wei Lin has authored 17 papers that have received a total of 1.0k indexed citations.
This includes 10 papers in Electrical and Electronic Engineering, 5 papers in Materials Chemistry and 5 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (5 papers), Advanced Battery Materials and Technologies (3 papers) and 3D IC and TSV technologies (3 papers). Yu‐Wei Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), Advanced Battery Materials and Technologies (3 papers) and 3D IC and TSV technologies (3 papers) and collaborates with scholars based in Taiwan, Australia and United States. Yu‐Wei Lin's co-authors include Kwang‐Lung Lin, Jeng‐Han Wang, Hsuan Lee, Meng-Fan Luo and Yucheng Wu and has published in prestigious journals such as The Journal of Chemical Physics, ACS Nano and Energy & Environmental Science.
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