Yangyang Yan

42 papers and 462 indexed citations i.

Yangyang Yan has authored 42 papers that have received a total of 462 indexed citations. This includes 20 papers in Electrical and Electronic Engineering, 11 papers in Mechanics of Materials and 9 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (13 papers), Electronic Packaging and Soldering Technologies (11 papers) and Vibration and Dynamic Analysis (7 papers). Yangyang Yan is often cited by papers focused on 3D IC and TSV technologies (13 papers), Electronic Packaging and Soldering Technologies (11 papers) and Vibration and Dynamic Analysis (7 papers) and collaborates with scholars based in China, Japan and United States. Yangyang Yan's co-authors include Yingtao Ding, Zhiming Chen, Qianwen Chen, Lei Xiao and Shiwei Wang and has published in prestigious journals such as Biophysical Journal, Chemical Engineering Journal and Acta Biomaterialia.