Y. L. Lin

24 papers and 717 indexed citations i.

Y. L. Lin has authored 24 papers that have received a total of 717 indexed citations. This includes 16 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 4 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (13 papers) and Intermetallics and Advanced Alloy Properties (5 papers). Y. L. Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (13 papers) and Intermetallics and Advanced Alloy Properties (5 papers) and collaborates with scholars based in Taiwan, China and United States. Y. L. Lin's co-authors include C. R. Kao, Cheng–En Ho, Cheng‐Hsien Tsai, Yi‐Shao Lai and Jang‐Zern Tsai and has published in prestigious journals such as Chemistry of Materials, Materials Science and Engineering A and Expert Systems with Applications.