Xin Fu Tan
About
Xin Fu Tan has authored 53 papers that have received a total of 538 indexed citations.
This includes 35 papers in Electrical and Electronic Engineering, 27 papers in Mechanical Engineering and 14 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (24 papers), Intermetallics and Advanced Alloy Properties (11 papers) and 3D IC and TSV technologies (11 papers). Xin Fu Tan is often cited by papers focused on Electronic Packaging and Soldering Technologies (24 papers), Intermetallics and Advanced Alloy Properties (11 papers) and 3D IC and TSV technologies (11 papers) and collaborates with scholars based in Australia, Japan and China. Xin Fu Tan's co-authors include Kazuhiro Nogita, Stuart D. McDonald, Qinfen Gu, Syo Matsumura and Michael Bermingham and has published in prestigious journals such as Journal of Power Sources, Acta Materialia and Electrochimica Acta.
In The Last Decade
Fields of papers published by Xin Fu Tan
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by Xin Fu Tan
Since SpecializationCitations
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