Xin Fu Tan

53 papers and 538 indexed citations i.

About

Xin Fu Tan has authored 53 papers that have received a total of 538 indexed citations. This includes 35 papers in Electrical and Electronic Engineering, 27 papers in Mechanical Engineering and 14 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (24 papers), Intermetallics and Advanced Alloy Properties (11 papers) and 3D IC and TSV technologies (11 papers). Xin Fu Tan is often cited by papers focused on Electronic Packaging and Soldering Technologies (24 papers), Intermetallics and Advanced Alloy Properties (11 papers) and 3D IC and TSV technologies (11 papers) and collaborates with scholars based in Australia, Japan and China. Xin Fu Tan's co-authors include Kazuhiro Nogita, Stuart D. McDonald, Qinfen Gu, Syo Matsumura and Michael Bermingham and has published in prestigious journals such as Journal of Power Sources, Acta Materialia and Electrochimica Acta.

In The Last Decade

Fields of papers published by Xin Fu Tan

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

Countries citing papers authored by Xin Fu Tan

Since Specialization
Citations
Rankless by CCL
2025