W. Steinhögl
About
W. Steinhögl has authored 23 papers that have received a total of 1.4k indexed citations.
This includes 15 papers in Electrical and Electronic Engineering, 13 papers in Electronic, Optical and Magnetic Materials and 9 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Semiconductor materials and devices (13 papers), Copper Interconnects and Reliability (13 papers) and Electronic Packaging and Soldering Technologies (4 papers). W. Steinhögl is often cited by papers focused on Semiconductor materials and devices (13 papers), Copper Interconnects and Reliability (13 papers) and Electronic Packaging and Soldering Technologies (4 papers) and collaborates with scholars based in Germany, Austria and France. W. Steinhögl's co-authors include M. Engelhardt, G. Schindler, G. Steinlesberger, E. Hulpke and M. Traving and has published in prestigious journals such as Physical Review Letters, The Journal of Chemical Physics and Journal of Applied Physics.
In The Last Decade
Fields of papers published by W. Steinhögl
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by W. Steinhögl
Since SpecializationCitations
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