W. Rieder
Impact in
- Mechanical Engineering top 5%
- Electrical Contact Performance and Analysis
- Advanced materials and composites
- Welding Techniques and Residual Stresses
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- Vacuum and Plasma Arcs
Papers in
-
- Electrical Contact Performance and Analysis 39
-
- Electrical Fault Detection and Protection 27
- Co-authors
- Peter Claus (11 shared papers)Martin Hammerschmidt (4 shared papers)Erich Kny (2 shared papers)Friedrich W. Vierhapper (5 shared papers)Clemens Veit (3 shared papers)E. Hardegger (2 shared papers)A. Walser (1 shared paper)W. Vycudilík (2 shared papers)
- Journals
- IEEE Transactions on Components and Packaging Technologies (9 papers)Tetrahedron Letters (4 papers)Tetrahedron (2 papers)Helvetica Chimica Acta (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology Part A (10 papers)
- Partner nations
- AustriaGermanyUnited States
In The Last Decade
W. Rieder
70 papers receiving 781 citations
Peers
Comparison fields: 5 of 62
- Mechanical Engineering 467
- Atomic and Molecular Physics, and Optics 308
- Mechanics of Materials 172
- Electrical and Electronic Engineering 378
- Organic Chemistry 171
Countries citing papers authored by W. Rieder
This map shows the geographic impact of W. Rieder's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by W. Rieder with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites W. Rieder more than expected).
Fields of papers citing papers by W. Rieder
This network shows the impact of papers produced by W. Rieder. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by W. Rieder. The network helps show where W. Rieder may publish in the future.
Co-authors
The 25 scholars most cited alongside W. Rieder, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 71 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1989 | 89 | |
| 2 | 1975 | 48 | |
| 3 | 2004 | 43 | |
| 4 | 2000 | 35 | |
| 5 | 1957 | 31 | |
| 6 | 1992 | 27 | |
| 7 | 1994 | 25 | |
| 8 | 2004 | 24 | |
| 9 | 1966 | 22 | |
| 10 | 1995 | 20 | |
| 11 | 2007 | 20 | |
| 12 | 1998 | 20 | |
| 13 | 2001 | 18 | |
| 14 | 2004 | 18 | |
| 15 | 1978 | 17 | |
| 16 | 1991 | 17 | |
| 17 | 1970 | 17 | |
| 18 | 1974 | 15 | |
| 19 | 1990 | 15 | |
| 20 | 1976 | 14 |
About W. Rieder
W. Rieder is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics, Mechanics of Materials and Organic Chemistry, having authored 71 papers that have together received 847 indexed citations. Recurring topics across this work include Electrical Contact Performance and Analysis (39 papers), Electrical Fault Detection and Protection (27 papers), Vacuum and Plasma Arcs (27 papers), Sulfur-Based Synthesis Techniques (10 papers), Adhesion, Friction, and Surface Interactions (9 papers), Organic and Inorganic Chemical Reactions (7 papers), Synthesis and Reactivity of Sulfur-Containing Compounds (7 papers) and Mechanical stress and fatigue analysis (7 papers). The work is most often cited by research in Mechanical Engineering (467 citations), Atomic and Molecular Physics, and Optics (308 citations), Mechanics of Materials (172 citations), Electrical and Electronic Engineering (378 citations) and Organic Chemistry (171 citations). W. Rieder has collaborated with scholars based in Austria, Germany and United States. Frequent co-authors include Peter Claus, Martin Hammerschmidt, Erich Kny, Friedrich W. Vierhapper, Clemens Veit, E. Hardegger, A. Walser, W. Vycudilík, G. Kresze and M. Berger. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies, Tetrahedron Letters, Tetrahedron, Helvetica Chimica Acta and IEEE Transactions on Components Packaging and Manufacturing Technology Part A.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.