V. Lapras

784 citations
20 papers · 378 · h-index 11

Impact in

    • 3D IC and TSV technologies
    • Semiconductor materials and devices
    • Advancements in Semiconductor Devices and Circuit Design
    • Electronic Packaging and Soldering Technologies
    • Integrated Circuits and Semiconductor Failure Analysis
    • Ferroelectric and Negative Capacitance Devices
    • Additive Manufacturing and 3D Printing Technologies

Papers in

V. Lapras

17 papers receiving 354 citations

Peers

V. Lapras
Comparison fields: 5 of 26
  • Electrical and Electronic Engineering 344
  • Automotive Engineering 43
  • Instrumentation 8
  • Biomedical Engineering 97
  • Hardware and Architecture 10
Replace Lieve Bogaerts with:
Lieve Bogaerts Belgium
G. Parès France
Xiangkun Yin China
Yu-Chen Hsin Taiwan
Teck Guan Lim Singapore
Kihyun Hwang South Korea
C. Tabone France
Wei‐Hsu Chang United States
S. Koffel Germany
S. Borel France
V. Lapras relative to Lieve Bogaerts Belgium Lieve Bogaerts's profile →
Citations per field
00.5×2.7×
Lieve Bogaerts · 1×
Citations per year

Countries citing papers authored by V. Lapras

Since Specialization
Citations

This map shows the geographic impact of V. Lapras's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by V. Lapras with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites V. Lapras more than expected).

Fields of papers citing papers by V. Lapras

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by V. Lapras. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by V. Lapras. The network helps show where V. Lapras may publish in the future.

Co-authors

The 25 scholars most cited alongside V. Lapras, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with V. Lapras Line = papers co-authored together V. Lapras links everyone, so they are left out of the graph.

All Works

20 of 20 papers shown
#Work
1 2017117
2 200866
3 200727
4 200827
5 201127
6 200924
7 201915
8 200815
9 201413
10 200911
11 201210
12 201010
13 20079
14 20223
15 20172
16 20221
17 20181
18 20240
19 20240
20 20250

About V. Lapras

V. Lapras is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics, Biomedical Engineering, Instrumentation and Electronic, Optical and Magnetic Materials, having authored 20 papers that have together received 378 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (9 papers), Electronic Packaging and Soldering Technologies (8 papers), Semiconductor materials and devices (5 papers), Silicon and Solar Cell Technologies (4 papers), Thin-Film Transistor Technologies (4 papers), Nanowire Synthesis and Applications (3 papers), Advancements in Semiconductor Devices and Circuit Design (3 papers) and Integrated Circuits and Semiconductor Failure Analysis (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (344 citations), Automotive Engineering (43 citations), Instrumentation (8 citations), Biomedical Engineering (97 citations) and Hardware and Architecture (10 citations). V. Lapras has collaborated with scholars based in France, Germany and Switzerland. Frequent co-authors include N. Sillon, David Henry, Bernard Aventurier, Jean Charbonnier, Xavier Baillin, C. Vizioz, Sylvain Barraud, B. Prévitali, C. Comboroure and J. Lacord. Their work appears in journals such as Applied Surface Science, Semiconductor Science and Technology, ECS Transactions, HAL (Le Centre pour la Communication Scientifique Directe) and Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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