V. Lapras
Impact in
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- 3D IC and TSV technologies
- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Ferroelectric and Negative Capacitance Devices
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- Additive Manufacturing and 3D Printing Technologies
Papers in
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- 3D IC and TSV technologies 9
- Electronic Packaging and Soldering Technologies 8
- Semiconductor materials and devices 5
- Silicon and Solar Cell Technologies 4
- Thin-Film Transistor Technologies 4
- Integrated Circuits and Semiconductor Failure Analysis 3
- Advancements in Semiconductor Devices and Circuit Design 3
- Co-authors
- N. Sillon (9 shared papers)David Henry (8 shared papers)Xavier Baillin (3 shared papers)Sylvain Barraud (3 shared papers)C. Vizioz (2 shared papers)B. Prévitali (4 shared papers)Jean Charbonnier (3 shared papers)Bernard Aventurier (3 shared papers)
- Journals
- Semiconductor Science and Technology (1 paper)Applied Surface Science (1 paper)ECS Transactions (2 papers)SPIRE - Sciences Po Institutional REpository (3 papers)2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (1 paper)
- Partner nations
- FranceGermanyUnited Kingdom
In The Last Decade
V. Lapras
17 papers receiving 330 citations
Peers
Comparison fields: 5 of 25
- Electrical and Electronic Engineering 319
- Automotive Engineering 36
- Instrumentation 8
- Biomedical Engineering 88
- Hardware and Architecture 9
Countries citing papers authored by V. Lapras
This map shows the geographic impact of V. Lapras's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by V. Lapras with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites V. Lapras more than expected).
Fields of papers citing papers by V. Lapras
This network shows the impact of papers produced by V. Lapras. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by V. Lapras. The network helps show where V. Lapras may publish in the future.
Co-authors
The 25 scholars most cited alongside V. Lapras, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2017 | 113 | |
| 2 | 2008 | 56 | |
| 3 | 2008 | 27 | |
| 4 | 2007 | 26 | |
| 5 | 2011 | 23 | |
| 6 | 2009 | 22 | |
| 7 | 2019 | 14 | |
| 8 | 2008 | 14 | |
| 9 | 2014 | 12 | |
| 10 | 2012 | 10 | |
| 11 | 2010 | 10 | |
| 12 | 2009 | 10 | |
| 13 | 2007 | 9 | |
| 14 | 2022 | 3 | |
| 15 | 2017 | 2 | |
| 16 | 2022 | 1 | |
| 17 | 2018 | 1 | |
| 18 | 2024 | 0 | |
| 19 | 2024 | 0 | |
| 20 | 2025 | 0 |
About V. Lapras
V. Lapras is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics, Biomedical Engineering, Instrumentation and Electronic, Optical and Magnetic Materials, having authored 20 papers that have together received 353 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (9 papers), Electronic Packaging and Soldering Technologies (8 papers), Semiconductor materials and devices (5 papers), Silicon and Solar Cell Technologies (4 papers), Thin-Film Transistor Technologies (4 papers), Nanowire Synthesis and Applications (3 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers) and Advancements in Semiconductor Devices and Circuit Design (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (319 citations), Automotive Engineering (36 citations), Instrumentation (8 citations), Biomedical Engineering (88 citations) and Hardware and Architecture (9 citations). V. Lapras has collaborated with scholars based in France, Germany and United Kingdom. Frequent co-authors include N. Sillon, David Henry, Xavier Baillin, Sylvain Barraud, C. Vizioz, B. Prévitali, Jean Charbonnier, Bernard Aventurier, J. Lacord and O. Rozeau. Their work appears in journals such as Semiconductor Science and Technology, Applied Surface Science, ECS Transactions, SPIRE - Sciences Po Institutional REpository and 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.