R. Taïbi
About
R. Taïbi has authored 7 papers that have received a total of 131 indexed citations.
This includes 5 papers in Electrical and Electronic Engineering, 3 papers in Electronic, Optical and Magnetic Materials and 2 papers in Plant Science. The topics of these papers are Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (4 papers) and Copper Interconnects and Reliability (3 papers). R. Taïbi is often cited by papers focused on Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (4 papers) and Copper Interconnects and Reliability (3 papers) and collaborates with scholars based in France, Switzerland and Algeria. R. Taïbi's co-authors include L. Di Cioccio, F. Rieutord, Pierric Gueguen, F. de Crécy and Belkacem Draoui and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and Microelectronics Reliability.
In The Last Decade
Fields of papers published by R. Taïbi
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by R. Taïbi
Since SpecializationCitations
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