R. Stengl

25 papers and 938 indexed citations i.

R. Stengl has authored 25 papers that have received a total of 938 indexed citations. This includes 25 papers in Electrical and Electronic Engineering, 4 papers in Biomedical Engineering and 3 papers in Materials Chemistry. The topics of these papers are Semiconductor materials and devices (12 papers), Advancements in Semiconductor Devices and Circuit Design (10 papers) and 3D IC and TSV technologies (9 papers). R. Stengl is often cited by papers focused on Semiconductor materials and devices (12 papers), Advancements in Semiconductor Devices and Circuit Design (10 papers) and 3D IC and TSV technologies (9 papers) and collaborates with scholars based in Germany, United States and Japan. R. Stengl's co-authors include U. Gösele, T.F. Meister, T. Y. Tan, Kiyoshi Mitani and V. Lehmann and has published in prestigious journals such as Advanced Materials, Applied Physics Letters and Journal of Applied Physics.