Qiang Jia

89 papers and 2.0k indexed citations i.

Qiang Jia has authored 89 papers that have received a total of 2.0k indexed citations. This includes 39 papers in Mechanical Engineering, 35 papers in Electrical and Electronic Engineering and 29 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (15 papers) and Aluminum Alloys Composites Properties (13 papers). Qiang Jia is often cited by papers focused on Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (15 papers) and Aluminum Alloys Composites Properties (13 papers) and collaborates with scholars based in China, Canada and Australia. Qiang Jia's co-authors include Guisheng Zou, Wei Guo, Hongqiang Zhang, Jingquan Liu and Peng Peng and has published in prestigious journals such as Journal of the American Chemical Society, Carbon and ACS Applied Materials & Interfaces.