Peter Børgesen

141 papers and 1.9k indexed citations i.

Peter Børgesen has authored 141 papers that have received a total of 1.9k indexed citations. This includes 89 papers in Electrical and Electronic Engineering, 41 papers in Materials Chemistry and 39 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (72 papers), 3D IC and TSV technologies (28 papers) and Copper Interconnects and Reliability (20 papers). Peter Børgesen is often cited by papers focused on Electronic Packaging and Soldering Technologies (72 papers), 3D IC and TSV technologies (28 papers) and Copper Interconnects and Reliability (20 papers) and collaborates with scholars based in United States, Germany and Denmark. Peter Børgesen's co-authors include Liang Yin, B.M.U. Scherzer, Nikolay Dimitrov, Luke Wentlent and W. Möller and has published in prestigious journals such as Journal of Geophysical Research Atmospheres, Journal of Applied Physics and Journal of The Electrochemical Society.