Paul Lauro
About
Paul Lauro has authored 21 papers that have received a total of 938 indexed citations.
This includes 17 papers in Electrical and Electronic Engineering, 9 papers in Mechanical Engineering and 4 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (7 papers) and Metal and Thin Film Mechanics (3 papers). Paul Lauro is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (7 papers) and Metal and Thin Film Mechanics (3 papers) and collaborates with scholars based in United States, South Korea and China. Paul Lauro's co-authors include Da‐Yuan Shih, Keith Fogel, J. A. Ott, Stephen W. Bedell and D. K. Sadana and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Advanced Energy Materials.
In The Last Decade
side by side view
Countries citing papers authored by Paul Lauro
Since SpecializationCitations
Explore authors with similar magnitude of impact
Breakdown of academic impact, for papers by Hongbo Cao Breakdown of academic impact, for papers by Fátima-Zahra Idrissi Breakdown of academic impact, for papers by Mark A. Rainey Breakdown of academic impact, for papers by Huaibo Sun Breakdown of academic impact, for papers by W. J. Ooms Breakdown of academic impact, for papers by Annika Hausmann Breakdown of academic impact, for papers by Shiran Ferber Breakdown of academic impact, for papers by Andrienne C. Friedli