Paul A. Flinn
About
Paul A. Flinn has authored 45 papers that have received a total of 1.4k indexed citations.
This includes 32 papers in Electrical and Electronic Engineering, 25 papers in Electronic, Optical and Magnetic Materials and 12 papers in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (23 papers), Semiconductor materials and devices (23 papers) and Electronic Packaging and Soldering Technologies (14 papers). Paul A. Flinn is often cited by papers focused on Copper Interconnects and Reliability (23 papers), Semiconductor materials and devices (23 papers) and Electronic Packaging and Soldering Technologies (14 papers) and collaborates with scholars based in United States, France and Australia. Paul A. Flinn's co-authors include J. C. Bravman, T. Marieb, Michael C. Madden, Paul R. Besser and William D. Nix and has published in prestigious journals such as The Journal of Chemical Physics, Applied Physics Letters and Journal of Applied Physics.
In The Last Decade
Explore authors with similar magnitude of impact
Breakdown of academic impact, for papers by Daniel Augustine Breakdown of academic impact, for papers by Henry J. Friedman Breakdown of academic impact, for papers by D.J. Adam Breakdown of academic impact, for papers by T. Krings Breakdown of academic impact, for papers by Jiyong Yang Breakdown of academic impact, for papers by Gyula Lázár Breakdown of academic impact, for papers by Kaixuan Ma Breakdown of academic impact, for papers by Lisa K. Akison