Panju Shang

27 papers and 1.1k indexed citations i.

About

Panju Shang has authored 27 papers that have received a total of 1.1k indexed citations. This includes 18 papers in Electrical and Electronic Engineering, 12 papers in Mechanical Engineering and 11 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (15 papers), Intermetallics and Advanced Alloy Properties (9 papers) and 3D IC and TSV technologies (8 papers). Panju Shang is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), Intermetallics and Advanced Alloy Properties (9 papers) and 3D IC and TSV technologies (8 papers) and collaborates with scholars based in China, United States and Hong Kong. Panju Shang's co-authors include Zhi‐Quan Liu, Jin Shang, Xueyong Pang, Jian Ku Shang and J. K. Shang and has published in prestigious journals such as Applied Physics Letters, Chemistry of Materials and Acta Materialia.

In The Last Decade

Fields of papers published by Panju Shang

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

Countries citing papers authored by Panju Shang

Since Specialization
Citations
Rankless by CCL
2025