Nety Krishna
About
Nety Krishna has authored 14 papers that have received a total of 754 indexed citations.
This includes 12 papers in Electrical and Electronic Engineering, 5 papers in Electronic, Optical and Magnetic Materials and 2 papers in Materials Chemistry. The topics of these papers are Semiconductor materials and devices (9 papers), Copper Interconnects and Reliability (5 papers) and Electronic Packaging and Soldering Technologies (4 papers). Nety Krishna is often cited by papers focused on Semiconductor materials and devices (9 papers), Copper Interconnects and Reliability (5 papers) and Electronic Packaging and Soldering Technologies (4 papers) and collaborates with scholars based in United States and India. Nety Krishna's co-authors include Michael Lane, Souvik Mahapatra, Qing Ma, H. Fujimoto and Reinhold H. Dauskardt and has published in prestigious journals such as Journal of Membrane Science, IEEE Transactions on Electron Devices and Journal of materials research/Pratt's guide to venture capital sources.
In The Last Decade
Fields of papers published by Nety Krishna
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by Nety Krishna
Since SpecializationCitations
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