N. LaBianca
Impact in
- Biomedical Engineering top 2%
- Nanofabrication and Lithography Techniques
- Microfluidic and Capillary Electrophoresis Applications
- Advanced Surface Polishing Techniques
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- Advanced MEMS and NEMS Technologies
- Advancements in Photolithography Techniques
- Photonic and Optical Devices
Papers in
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- Electronic Packaging and Soldering Technologies 4
- 3D IC and TSV technologies 4
- Advancements in Photolithography Techniques 3
- Silicon Carbide Semiconductor Technologies 3
- Advanced MEMS and NEMS Technologies 2
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- Heat Transfer and Optimization 5
- Heat Transfer and Boiling Studies 4
- Co-authors
- Jeffrey D. Gelorme (4 shared papers)Philippe Renaud (1 shared paper)M. Despont (1 shared paper)H. Lorenz (1 shared paper)P. Vettiger (1 shared paper)Jane M. Shaw (3 shared papers)S. A. Rishton (2 shared papers)Willard E. Conley (1 shared paper)
- Journals
- IBM Journal of Research and Development (2 papers)IEEE Transactions on Components and Packaging Technologies (2 papers)Optics Express (1 paper)Journal of Micromechanics and Microengineering (1 paper)Journal of Heat Transfer (1 paper)
- Partner nations
- United StatesSwitzerlandGermany
In The Last Decade
N. LaBianca
15 papers receiving 1.9k citations
N. LaBianca's Hit Papers
Peers
Comparison fields: 5 of 88
- Biomedical Engineering 996
- Electrical and Electronic Engineering 1.2k
- Surfaces, Coatings and Films 104
- Bioengineering 77
- Mechanical Engineering 456
Countries citing papers authored by N. LaBianca
This map shows the geographic impact of N. LaBianca's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by N. LaBianca with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites N. LaBianca more than expected).
Fields of papers citing papers by N. LaBianca
This network shows the impact of papers produced by N. LaBianca. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by N. LaBianca. The network helps show where N. LaBianca may publish in the future.
Co-authors
The 25 scholars most cited alongside N. LaBianca, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | SU-8: a low-cost negative resist for MEMS Hit paper breakdown → | 1997 | 756 |
| 2 | 1995 | 295 | |
| 3 | 1997 | 246 | |
| 4 | 2007 | 197 | |
| 5 | 1995 | 90 | |
| 6 | 2005 | 87 | |
| 7 | 2007 | 63 | |
| 8 | 1993 | 60 | |
| 9 | 2006 | 56 | |
| 10 | 2009 | 39 | |
| 11 | 2009 | 29 | |
| 12 | 1998 | 17 | |
| 13 | 2001 | 14 | |
| 14 | 2006 | 12 | |
| 15 | 2006 | 6 |
About N. LaBianca
N. LaBianca is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Biomedical Engineering, Bioengineering and Electronic, Optical and Magnetic Materials, having authored 15 papers that have together received 2.0k indexed citations. Recurring topics across this work include Heat Transfer and Optimization (5 papers), Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (4 papers), Heat Transfer and Boiling Studies (4 papers), Advancements in Photolithography Techniques (3 papers), Silicon Carbide Semiconductor Technologies (3 papers), Advanced MEMS and NEMS Technologies (2 papers) and Thermal properties of materials (2 papers). The work is most often cited by research in Biomedical Engineering (996 citations), Electrical and Electronic Engineering (1.2k citations), Surfaces, Coatings and Films (104 citations), Bioengineering (77 citations) and Mechanical Engineering (456 citations). N. LaBianca has collaborated with scholars based in United States, Switzerland and Germany. Frequent co-authors include Jeffrey D. Gelorme, Philippe Renaud, M. Despont, H. Lorenz, P. Vettiger, Jane M. Shaw, S. A. Rishton, Willard E. Conley, T. H. P. Chang and Michael Gaynes. Their work appears in journals such as IBM Journal of Research and Development, IEEE Transactions on Components and Packaging Technologies, Optics Express, Journal of Micromechanics and Microengineering and Journal of Heat Transfer.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.