Mei-Ling Wu

30 papers and 341 indexed citations i.

About

Mei-Ling Wu has authored 30 papers that have received a total of 341 indexed citations. This includes 17 papers in Electrical and Electronic Engineering, 12 papers in Mechanics of Materials and 11 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (12 papers) and Metal Forming Simulation Techniques (6 papers). Mei-Ling Wu is often cited by papers focused on Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (12 papers) and Metal Forming Simulation Techniques (6 papers) and collaborates with scholars based in Taiwan and United States. Mei-Ling Wu's co-authors include William D. Sproul, Liang-Yu Wu, Lien-Wen Chen, Lien-Wen Chen and Yeong‐Maw Hwang and has published in prestigious journals such as Materials Science and Engineering A, Journal of Physics Condensed Matter and Thin Solid Films.

In The Last Decade

Fields of papers published by Mei-Ling Wu

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

Countries citing papers authored by Mei-Ling Wu

Since Specialization
Citations
Rankless by CCL
2025