Matthias Hütter
About
Matthias Hütter has authored 25 papers that have received a total of 222 indexed citations.
This includes 23 papers in Electrical and Electronic Engineering, 5 papers in Condensed Matter Physics and 4 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (11 papers) and GaN-based semiconductor devices and materials (5 papers). Matthias Hütter is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (11 papers) and GaN-based semiconductor devices and materials (5 papers) and collaborates with scholars based in Germany, Austria and Spain. Matthias Hütter's co-authors include Hermann Oppermann, H. Reichl, Elke Kraker, Franz Schrank and S. Weiß and has published in prestigious journals such as Journal of Applied Physics, Scripta Materialia and Japanese Journal of Applied Physics.
In The Last Decade
Explore authors with similar magnitude of impact
Top fields papers by Che Aniza Che Wel are about Top fields papers by I. Yonekawa are about Top authors papers by Kyoko Hirano are co-authored with Top fields papers by Georgi Manukjan are about Top journals papers by L I Zander are published in Top journals papers by L. Borrajo are published in Top countries impacted by papers by Alexandru Marțian Top journals papers by J. Westphal are published in