Le Luo
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Chalcogenide Semiconductor Thin Films
- Advanced MEMS and NEMS Technologies
- Semiconductor materials and devices
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- Copper Interconnects and Reliability
Papers in
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- 3D IC and TSV technologies 68
- Electronic Packaging and Soldering Technologies 63
- Advanced MEMS and NEMS Technologies 17
- Microwave Engineering and Waveguides 9
- Radio Frequency Integrated Circuit Design 9
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- Acoustic Wave Resonator Technologies 8
- Co-authors
- Gaowei Xu (55 shared papers)Xiaojuan Liang (4 shared papers)Weidong Xiang (4 shared papers)Jiasong Zhong (4 shared papers)Hailong Yang (2 shared papers)Jing Wang (2 shared papers)Yuan Yuan (7 shared papers)Weidong Huang (8 shared papers)
In The Last Decade
Le Luo
141 papers receiving 1.1k citations
Peers
Comparison fields: 5 of 107
- Electrical and Electronic Engineering 834
- Electronic, Optical and Magnetic Materials 115
- Materials Chemistry 283
- Mechanical Engineering 206
- General Materials Science 16
Countries citing papers authored by Le Luo
This map shows the geographic impact of Le Luo's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Le Luo with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Le Luo more than expected).
Fields of papers citing papers by Le Luo
This network shows the impact of papers produced by Le Luo. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Le Luo. The network helps show where Le Luo may publish in the future.
Co-authors
The 25 scholars most cited alongside Le Luo, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 150 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2013 | 97 | |
| 2 | 2001 | 86 | |
| 3 | 2003 | 84 | |
| 4 | 2013 | 47 | |
| 5 | 2017 | 33 | |
| 6 | 2023 | 28 | |
| 7 | 2007 | 28 | |
| 8 | 2023 | 28 | |
| 9 | 2022 | 21 | |
| 10 | 2010 | 21 | |
| 11 | 2000 | 20 | |
| 12 | 2002 | 19 | |
| 13 | 2014 | 18 | |
| 14 | 2009 | 18 | |
| 15 | 2014 | 16 | |
| 16 | 2016 | 15 | |
| 17 | 2006 | 15 | |
| 18 | 2023 | 13 | |
| 19 | 2010 | 13 | |
| 20 | 2014 | 13 |
About Le Luo
Le Luo is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Electronic, Optical and Magnetic Materials, Mechanical Engineering and Mechanics of Materials, having authored 150 papers that have together received 1.1k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (68 papers), Electronic Packaging and Soldering Technologies (63 papers), Copper Interconnects and Reliability (18 papers), Advanced MEMS and NEMS Technologies (17 papers), Microwave Engineering and Waveguides (9 papers), Radio Frequency Integrated Circuit Design (9 papers), Acoustic Wave Resonator Technologies (8 papers) and Advanced Welding Techniques Analysis (8 papers). The work is most often cited by research in Electrical and Electronic Engineering (834 citations), Electronic, Optical and Magnetic Materials (115 citations), Materials Chemistry (283 citations), Mechanical Engineering (206 citations) and General Materials Science (16 citations). Le Luo has collaborated with scholars based in China, Germany and Hong Kong. Frequent co-authors include Gaowei Xu, Xiaojuan Liang, Weidong Xiang, Jiasong Zhong, Hailong Yang, Jing Wang, Yuan Yuan, Weidong Huang, Gong Cheng and Jiajie Tang. Their work appears in journals such as Journal of Electronic Materials, Microsystem Technologies, Journal of Semiconductors, Journal of Materials Science Materials in Electronics and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.