Kun-Han Tsai

26 papers and 156 indexed citations i.

Kun-Han Tsai has authored 26 papers that have received a total of 156 indexed citations. This includes 24 papers in Electrical and Electronic Engineering, 20 papers in Hardware and Architecture and 4 papers in Biomedical Engineering. The topics of these papers are Integrated Circuits and Semiconductor Failure Analysis (21 papers), VLSI and Analog Circuit Testing (19 papers) and 3D IC and TSV technologies (9 papers). Kun-Han Tsai is often cited by papers focused on Integrated Circuits and Semiconductor Failure Analysis (21 papers), VLSI and Analog Circuit Testing (19 papers) and 3D IC and TSV technologies (9 papers) and collaborates with scholars based in United States, Taiwan and Hungary. Kun-Han Tsai's co-authors include Wu-Tung Cheng, Malgorzata Marek-Sadowska, Shi‐Yu Huang, J. Rajski and Shih‐Wei Lee and has published in prestigious journals such as IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems and IEEE Design and Test.