Ker‐Chang Hsieh

70 papers and 1.1k indexed citations i.

Ker‐Chang Hsieh has authored 70 papers that have received a total of 1.1k indexed citations. This includes 56 papers in Mechanical Engineering, 23 papers in Electrical and Electronic Engineering and 21 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (18 papers), Intermetallics and Advanced Alloy Properties (18 papers) and Metallurgical Processes and Thermodynamics (12 papers). Ker‐Chang Hsieh is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), Intermetallics and Advanced Alloy Properties (18 papers) and Metallurgical Processes and Thermodynamics (12 papers) and collaborates with scholars based in Taiwan, United States and China. Ker‐Chang Hsieh's co-authors include Y. A. Chang, J.S.C. Jang, J.C. Huang, Hsin‐Jay Wu and Chih‐Yen Chen and has published in prestigious journals such as Applied Physics Letters, Acta Materialia and Journal of Alloys and Compounds.