Jonathan Reid

28 papers and 757 indexed citations i.

Jonathan Reid has authored 28 papers that have received a total of 757 indexed citations. This includes 17 papers in Electrical and Electronic Engineering, 12 papers in Materials Chemistry and 11 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electrodeposition and Electroless Coatings (15 papers), Copper Interconnects and Reliability (11 papers) and Corrosion Behavior and Inhibition (6 papers). Jonathan Reid is often cited by papers focused on Electrodeposition and Electroless Coatings (15 papers), Copper Interconnects and Reliability (11 papers) and Corrosion Behavior and Inhibition (6 papers) and collaborates with scholars based in United States and United Kingdom. Jonathan Reid's co-authors include Richard P. Buck, Tighe A. Spurlin, Matthew A. Rigsby, Yihua Liu and Petr Vanýsek and has published in prestigious journals such as Journal of The Electrochemical Society, Japanese Journal of Applied Physics and Journal of Applied Polymer Science.