John Ryan C. Dizon
Impact in
- Automotive Engineering top 0.2%
- Additive Manufacturing and 3D Printing Technologies
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- Manufacturing Process and Optimization
Papers in
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- Superconducting Materials and Applications 21
- 3D Printing in Biomedical Research 9
- Advanced Sensor and Energy Harvesting Materials 6
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- Additive Manufacturing and 3D Printing Technologies 31
- Co-authors
- Rigoberto C. Advíncula (17 shared papers)Qiyi Chen (8 shared papers)Alejandro H. Espera (9 shared papers)Arnaldo D. Valino (6 shared papers)Hyung-Seop Shin (24 shared papers)Rigoberto C. Advincula (1 shared paper)Jamie M. Messman (1 shared paper)Sang-Soo Oh (14 shared papers)
- Journals
- MRS Communications (9 papers)Physica C Superconductivity (7 papers)IEEE Transactions on Applied Superconductivity (7 papers)Applied Materials Today (2 papers)Cryogenics (2 papers)
- Partner nations
- South KoreaPhilippinesUnited States
In The Last Decade
John Ryan C. Dizon
67 papers receiving 3.1k citations
John Ryan C. Dizon's Hit Papers
Peers
Comparison fields: 5 of 137
- Automotive Engineering 2.0k
- Industrial and Manufacturing Engineering 528
- Biomedical Engineering 1.5k
- Condensed Matter Physics 382
- Building and Construction 407
Countries citing papers authored by John Ryan C. Dizon
This map shows the geographic impact of John Ryan C. Dizon's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by John Ryan C. Dizon with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites John Ryan C. Dizon more than expected).
Fields of papers citing papers by John Ryan C. Dizon
This network shows the impact of papers produced by John Ryan C. Dizon. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by John Ryan C. Dizon. The network helps show where John Ryan C. Dizon may publish in the future.
Co-authors
The 25 scholars most cited alongside John Ryan C. Dizon, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 71 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Mechanical characterization of 3D-printed polymers Hit paper breakdown → | 2017 | 1034 |
| 2 | Advances in 3D printing of thermoplastic polymer composites and nanocomposites Hit paper breakdown → | 2019 | 425 |
| 3 | 2019 | 253 | |
| 4 | 2019 | 211 | |
| 5 | 2021 | 175 | |
| 6 | 2005 | 98 | |
| 7 | 2021 | 95 | |
| 8 | 2020 | 68 | |
| 9 | 2022 | 66 | |
| 10 | 2019 | 58 | |
| 11 | 2018 | 55 | |
| 12 | 2009 | 48 | |
| 13 | 2014 | 47 | |
| 14 | 2022 | 44 | |
| 15 | 2013 | 36 | |
| 16 | 2020 | 35 | |
| 17 | 2021 | 35 | |
| 18 | 2009 | 34 | |
| 19 | 2007 | 34 | |
| 20 | 2021 | 29 |
About John Ryan C. Dizon
John Ryan C. Dizon is a scholar working on Biomedical Engineering, Automotive Engineering, Condensed Matter Physics, Electrical and Electronic Engineering and Mechanical Engineering, having authored 71 papers that have together received 3.3k indexed citations. Recurring topics across this work include Additive Manufacturing and 3D Printing Technologies (31 papers), Physics of Superconductivity and Magnetism (22 papers), Superconducting Materials and Applications (21 papers), Manufacturing Process and Optimization (16 papers), HVDC Systems and Fault Protection (13 papers), 3D Printing in Biomedical Research (9 papers), Additive Manufacturing Materials and Processes (6 papers) and Advanced Sensor and Energy Harvesting Materials (6 papers). The work is most often cited by research in Automotive Engineering (2.0k citations), Industrial and Manufacturing Engineering (528 citations), Biomedical Engineering (1.5k citations), Condensed Matter Physics (382 citations) and Building and Construction (407 citations). John Ryan C. Dizon has collaborated with scholars based in South Korea, Philippines and United States. Frequent co-authors include Rigoberto C. Advíncula, Qiyi Chen, Alejandro H. Espera, Arnaldo D. Valino, Hyung-Seop Shin, Rigoberto C. Advincula, Jamie M. Messman, Sang-Soo Oh, Arman Ray Nisay and Leonard D. Tijing. Their work appears in journals such as MRS Communications, Physica C Superconductivity, IEEE Transactions on Applied Superconductivity, Applied Materials Today and Cryogenics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.